Wafer encapsulation method
A chip packaging and chip technology, applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of time-consuming and high cost, reduce reflow baking, improve bonding ability, and hinder thermal diffusion Effect
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[0022] In order to further explain the technical solution of the present invention, the present invention will be described in detail below through specific examples.
[0023] Such as image 3 The structure containing non-conductive glue (NCP) of the present invention is to apply flux 2 on the copper pillar between the integrated circuit 1 and the substrate 4, and connect the two by welding, and the substrate 4 is coated with non-conductive glue (NCP) 3. Solder balls 5 are arranged under the substrate to form a packaged integrated circuit structure.
[0024] Such as Figure 4 Shown, a kind of chip packaging method of the present invention comprises the following steps:
[0025] The wafer is cut by a wafer cutting machine, and then the wafer is picked up by the loading equipment, and the tin bumps of the wafer are stained with flux.
[0026] Then use the glue material printing equipment to apply the non-conductive glue (NCP) on the front of the substrate by steel plate print...
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