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A capping device for capping a semiconductor laser and its working method

A technology of semiconductors and lasers, which is applied in semiconductor lasers, lasers, laser components, etc., can solve problems such as single function and single tube cap arrangement function, and achieve the effects of improving work efficiency, rich functions, and reducing production costs

Active Publication Date: 2018-11-09
潍坊华光光电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is still a method that basically relies on manpower, and it is impossible to avoid contact with the cap during the operation, and this method is only a single function of arranging the caps, and the function is single

Method used

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  • A capping device for capping a semiconductor laser and its working method
  • A capping device for capping a semiconductor laser and its working method
  • A capping device for capping a semiconductor laser and its working method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] as the picture shows.

[0040] A capping device for capping a semiconductor laser, comprising a material tray 7 and a guide groove group; the bottom surface of the material tray 7 is inclined; the guide groove group includes 15 inclined guide grooves 2; the bottom outlet of the guide groove 2 is rotated and provided with The limited gear 3; the side wall of the tray 7 is provided with a cap through hole 1 for the cap to pass through; the cap through hole 1 is set opposite to the entrance 9 of the guide groove.

Embodiment 2

[0042] The capping device for capping a semiconductor laser as described in Embodiment 1 is different in that the limiting gear includes 3 teeth; the angle between adjacent teeth is 120°. Through the rotation of the limited gear 3, the pinion is inserted into the bottom end jack of the semiconductor laser sealing cap, so as to realize the limited transfer of the sealing cap.

[0043] The angle between the guide groove 2 and the horizontal plane is 30°. The advantage of the design here is that one of the gear teeth is set parallel to the guide groove 2, the gear teeth are socketed with the cap, and the limit gear is rotated 120°. After the cap is moved to a vertical plane, the cap falls into the seal by its own gravity. In the cap hole 5, the third pinion just arrives at the initial position, that is, the position parallel to the guide groove 2, and there is no need to adjust the position of the pinion, which further improves the production efficiency.

Embodiment 3

[0045] The capping device for capping a semiconductor laser as described in Embodiment 2 is different in that the width of the pinion is 2-3 mm smaller than the inner diameter of the cap.

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PUM

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Abstract

The invention relates to a cap mounting device of a semiconductor laser sealing cap and a working method thereof. The cap mounting device comprises a material disc and a guide groove group; the bottom surface of the material disc is arranged aslant; the guide groove group comprises a plurality of guide grooves arranged aslant; a bottom outlet of the guide groove is rotationally provided with a quantity limiting gear; a side wall of the material disc is provided with a sealing cap through hole for penetration of a sealing cap; and the sealing cap through hole is arranged to be opposite to an inlet of the guide groove. With the cap mounting device of the semiconductor laser sealing cap provided by the invention, manually arranging pipe caps one by one and contact with the pipe caps are avoided, and thus, influence on quality of the whole semiconductor laser caused by pollution to the pipe caps is avoided.

Description

technical field [0001] The invention relates to a capping device for capping a semiconductor laser and a working method thereof, belonging to the technical field of laser packaging. Background technique [0002] In the 1970s, the success of room temperature continuous oscillation of semiconductor lasers and the realization of low-loss optical fibers opened the prelude to the era of optoelectronics. Due to the advantages of small size, light weight, high efficiency, long life, easy modulation and low price, semiconductor lasers have been widely used in industry, medicine and military fields. This also promotes the industrialization of semiconductor lasers, but in the production process, semiconductor lasers are prone to touch the light-emitting surface, resulting in three types of failures: early failure, accidental failure, and loss failure. [0003] The internal chip is an important part of the semiconductor laser. The internal chip is expensive, the material is special, a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/022
CPCH01S5/02325
Inventor 王洪波赵克宁徐现刚
Owner 潍坊华光光电子有限公司
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