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Preparation method for resin diamond wire capable of improving diamond holding force

A diamond wire and diamond technology, applied in the field of resin diamond wire preparation, can solve the problems of inability to form an effective chemical bond between resin liquid and diamond, low production cost, low environmental pollution, etc., and achieves good cutting surface quality and high cutting efficiency. , the effect of improving the binding ability

Inactive Publication Date: 2016-11-16
HENAN XINDAXIN SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the current situation that effective chemical bonds cannot be formed between the resin liquid and the diamond in the production of the existing resin diamond wire, and to provide a method for preparing a resin diamond wire that improves the holding force of the diamond, which can improve the bond between the resin liquid and the diamond. Excellent binding force, low energy consumption, low environmental pollution, and low production cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A method for producing a resin diamond wire that improves diamond holding power, comprising the following steps:

[0023] (1) Preparation of diamond micropowder treatment liquid: by weight percentage, take 3% KH560, 90% absolute ethanol, and 7% water; magnetically stir and mix for 1.5 h at room temperature to form a uniform solution;

[0024] (2) Diamond treatment: add diamond powder with a particle size of 10-20 microns to a sodium hydroxide solution with a concentration of 2wt%; stir for 1.5 h at 55°C, and then separate the diamond powder by vacuum filtration , and then wash the diamond powder with water until it is neutral, and dry it; add the treated diamond powder into the diamond micropowder treatment solution obtained in step (1), and heat and stir for 2.5 h at 60°C; The diamond powder is separated by filtration, then cleaned with alcohol and dried;

[0025] (3) Preparation of diamond wire resin liquid: by weight percentage, the diamond wire resin liquid include...

Embodiment 2

[0029] A method for producing a resin diamond wire that improves diamond holding power, comprising the following steps:

[0030] (1) Preparation of diamond micropowder treatment solution: by weight percentage, take 2.5% KH570, 91% denatured alcohol, and 6.5% water; magnetically stir and mix for 2.5 h at room temperature to form a uniform solution;

[0031] (2) Diamond treatment: Add diamond powder with a particle size of 10 to 20 microns into a potassium hydroxide solution with a concentration of 1.5%; stir for 2 hours at 60°C, and then separate the diamond powder by vacuum filtration. Finally, wash the diamond powder with water until it is neutral, and dry it; add the treated diamond powder to the diamond micropowder treatment solution obtained in step (1), and heat and stir for 2.5 h at 60°C; Separate the diamond powder, then wash it with alcohol and dry it;

[0032] (3) Preparation of diamond wire resin liquid: by weight percentage, the diamond wire resin liquid includes: ...

Embodiment 3

[0036] A method for producing a resin diamond wire that improves diamond holding power, comprising the following steps:

[0037] (1) Preparation of diamond micropowder treatment solution: Take 3.5% of KH550, 90% of industrial alcohol, and 6.5% of water in terms of weight percentage; magnetically stir and mix for 1.5 h at room temperature to form a uniform solution;

[0038](2) Diamond treatment: Add diamond powder with a particle size of 10 to 20 microns into a sodium hydroxide solution with a concentration of 2.5%; stir for 3 hours at 65°C, and then separate the diamond powder by vacuum filtration. Finally, wash the diamond powder with water until it is neutral, and dry it; add the treated diamond powder to the diamond micropowder treatment solution obtained in step (1), and heat and stir for 2.5 h at 60°C; Separate the diamond powder, then wash it with alcohol and dry it;

[0039] (3) Preparation of diamond wire resin liquid: In terms of weight percentage, the diamond wire ...

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Abstract

The present invention relates to the preparation method of the resin diamond wire which can improve the diamond holding force, comprising the following steps: (1) preparation of diamond powder treatment solution: 1-10% silane coupling agent, 85-92% organic solvent, 1- 10% water; (2) diamond treatment; (3) preparation of diamond wire resin liquid: 20-50% resin powder, 10-30% organic solvent, 10-30% silicon carbide powder, 1-10 % of nanofibers, 20-40% of diamond powder treated in step (2); (4) coating of steel wire; (5) curing: primary curing, curing temperature is 500-900°C, secondary curing, A stepwise heating process is adopted, and finally the temperature is naturally lowered to room temperature with the furnace to obtain the finished resin diamond wire. The method of the invention can improve the binding force between the resin liquid and the diamond, has low energy consumption, little environmental pollution and low production cost.

Description

technical field [0001] The invention relates to a method for preparing a resin diamond wire which can improve the holding force of diamond. The obtained resin diamond wire can be used in the cutting and squaring of monocrystalline silicon ingots and polycrystalline silicon ingots in the solar photovoltaic industry, the cutting of sapphire, glass and other hard and brittle Material cutting and other fields. Background technique [0002] The environmental pollution caused by the extensive use of fossil fuels is becoming more and more serious, and the use of new renewable energy has attracted more and more attention from all over the world. As a clean energy source, the use of solar energy has attracted more and more attention. With the continuous development of cutting technology, crystalline silicon wafers are becoming thinner and thinner. [0003] The traditional free abrasive cutting method causes serious pollution, long cutting time and low cutting efficiency during the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00C09D161/06C09D163/00C09D179/08C09D7/12
CPCB24D18/0054C08K2201/011C08L2205/03C08L2205/035C09D7/62C09D7/70C09D161/06C09D163/00C09D179/08C08L63/00C08L79/08C08L33/20C08K7/14C08K7/06C08K13/06C08K9/06C08K3/04
Inventor 孙毅黄萱怡王超立杨正宏张志刚陈亚丽辛玲徐元清
Owner HENAN XINDAXIN SCI & TECH
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