Layered structure, switching element, magnetic device, and method for manufacturing layered structure
A technology of switching elements and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve problems such as difficulty in magnetization orientation, achieve power saving, easy control, and increase recording density.
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[0094] Next, an example of a laminated structure according to an embodiment of the present invention will be described. The laminated structure as an example of this embodiment has a multiferroic structure of ferromagnetic / nonmagnetic multilayer film / ferroelectric, and consists of [Cu / Ni] multilayer film / Cu intermediate layer / Fe base layer / BaTiO 3 Single crystal composition. In this example, the [Cu / Ni] multilayer film with 5 cycles and BaTiO 3 The Fe base layer and the Cu intermediate layer are inserted between them, resulting in the formation of a [Cu / Ni] multilayer film on BaTiO 3 structure obtained by epitaxial growth. As a result, the ferroelectric BaTiO can be efficiently transferred through the joint interface of the [Cu / Ni] multilayer film. 3 piezoelectric strain.
[0095] For the manufacturing method of the stacked structure of this embodiment, first, using an ultra-high vacuum MBE device, a single crystal BaTiO having an in-plane-vertical dielectric multipolariza...
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