High-reliability pressure-adjusting automatic testing apparatus for fingerprint module group

Abstract

The invention discloses a high-reliability pressure-adjusting automatic testing apparatus for a fingerprint module group. The automatic testing apparatus comprises a pedestal, a left support plate, a right support plate, a horizontal bridge plate, at least one horizontal objective table and a switching board installed on the horizontal objective table. The horizontal bridge plate is fixed between the respective upper ends of the left support plate and the right support plate. At least one lifting plate is arranged between the horizontal bridge plate and the horizontal bridge plate; and an inverted-T-shaped through hole is formed in the upper end of the lifting plate and is formed by a penetrating connecting hole and a rectangular through hole. A hanging plate is installed on the front end surface of the lifting plate; a plastic cavity box is installed at the lower end surface of the hanging plate; and a left cylinder, a right cylinder, and a testing pressing head seta are arranged in the cavity of the plastic cavity box respectively; and a testing pressing head for detecting an electrical performance of the fingerprint module group is fixed at the testing pressing head. According to the invention, the force applied on a product force can be adjusted and controlled; and products for testing are diversified. After testing by multiple times, the testing apparatus with the pressure applying tool can have a stable testing result; and testing results are consistent.

Description

technical field [0001] The invention relates to a test device, in particular to a highly reliable pressure-adjustable automatic test device for a fingerprint module. Background technique [0002] With the development of electronic technology, there are more and more functional and user-friendly mobile devices. For example, Apple installed a fingerprint recognition chip on the main button of Iphone5s for the first time, which brought users a convenient and fast body feeling. Since then, it has been equipped with fingerprint recognition chips. Functional mobile phones have become the basis for the public to choose mobile phones, and other brands of mobile phone manufacturers have also equipped their mobile phones with fingerprint locks. [0003] Therefore, this also brings opportunities and challenges to fingerprint module packaging companies. How to improve product performance and production efficiency is what they need to care about. In each process of fingerprint module pac...

AI Technical Summary

Problems solved by technology

[0003] Therefore, this also brings opportunities and challenges to fingerprint module packaging companies. How to improve product performance and production efficiency is what they need to care about. In each process of fingerprint module packaging, fingerprint module functional testing is very critical. Now Existing technologies are pneumatic and pressure rod pressure methods. Due to the problems of these two pressure fixtures, the force exerted by the test pressure head connected to them on the product surface is unstable, which affects the reliability of product testing. Although the above One advantage of the pressure application method is that the pressure value is adjustable, but the adjustable range is limited. For example, the pneumatic pressure application method is difficult to provide low pressure. Therefore, when improving the pressure application method in the test device, a better solution The scheme should not only take into account the improvement of test stability, but also make the pressure easy to adjust

Images