Power module and manufacturing method therefor

Abstract

The invention provides a power module and a manufacturing method therefor. The power module comprises a substrate, at least one power device, and an organic heat dissipation mechanism. The substrate is provided with an upper surface and a lower surface. The organic heat dissipation mechanism comprises a plurality of organic heat dissipation convex parts, and the organic heat dissipation mechanism is located at a side of the upper surface or the lower surface of the substrate, so as to conduct the heat generated by the power device to the outside. Because the organic heat dissipation mechanism can manufacture a larger surface area, the organic heat dissipation mechanism can greatly reduce the heat exchange thermal resistance between the organic heat dissipation mechanism and an environment, thereby improving the heat dissipation performance of the heat exchange of the organic heat dissipation mechanism and the environment. Therefore, the power module can reduce the height of the organic heat dissipation mechanism under the condition that the normal heat dissipation of the power module is guaranteed, reduces the occupied space, and is of great significance to the implementation of the miniaturization of the power module.

Description

technical field [0001] The present application relates to power modules, in particular to power modules with heat dissipation mechanisms. Background technique [0002] High efficiency, high power density and high reliability have always been the industry's requirements for power modules, especially power converters. High efficiency means reducing energy consumption, which is conducive to energy saving, emission reduction, environmental protection, and reduced use costs. High power density means small size and light weight, reducing transportation costs and space requirements, thereby reducing construction costs. High reliability means longer service life and maintenance costs. [0003] But these three indicators pursued by the industry are closely related to good thermal management. First, at a lower operating temperature, the on-state loss of power modules such as Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) will be reduced, which is beneficial to the impro...

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Problems solved by technology

[0008] 1. Since the heat sink is usually formed by extruding metal such as copper, it is heavy and difficult to process. It is difficult to process short and dense, and it is difficult to make a very large specific surface area. Therefore, it is more suitable for modules with large volume and height. , is not conducive to the miniaturization of the product

And, because the fins of the heat sink are long, it is easy to contact with other electronic components, causing a short circuit

[0009] 2. The power element and the radiator are combined by spring clips. Due to the use of spring clips, the space utilization rate of the device becomes extremely low, which does not meet our requirements for power density.

Moreover, for reliable fixed connection, the power module is usually designed to have a thicker sealing material, and the power device itself has a higher

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