Heat dissipation assembly structure of LED (Light Emitting Diode) street lamp

A technology for LED street lamps and assembly structures, which is applied in cooling/heating devices of lighting devices, lighting devices, lighting and heating equipment, etc., and can solve problems such as waste of materials, poor heat dissipation, and heavy weight

Inactive Publication Date: 2016-06-29
史勇
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-power LED light source for semiconductor lighting will eventually completely replace the traditional light source. Performance and life are inversely proportional to the working junction temperature of the LED light source. Therefore, when in use, a good heat dissipation design is required to reduce the working temperature of the LED light source and then reduce its junction temperature. Street lamps need good airtightness in harsh outdoor environments To achieve the effect of waterproof and dustproof, this kind of airtight environment is not conducive to the heat dissipation of LED light source, thus affecting the performance and service life of LED street lamps. The radiator of existing high-power LED lamps is generally a solid core body, and the radiator is external The "fish gill" shape heat sink has the disadvantages of heavy weight, waste of materials, poor heat dissipation, etc.

Method used

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  • Heat dissipation assembly structure of LED (Light Emitting Diode) street lamp
  • Heat dissipation assembly structure of LED (Light Emitting Diode) street lamp
  • Heat dissipation assembly structure of LED (Light Emitting Diode) street lamp

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Embodiment Construction

[0012] The present invention will be further described below in conjunction with accompanying drawing:

[0013] As shown in the accompanying drawings, a heat dissipation assembly structure for LED street lamps is characterized in that it is composed of a baffle plate 1 and a heat dissipation substrate 2. The heat dissipation substrate 2 is in a semi-cylindrical shape, and upward heat dissipation ribs 3 are provided on the arc surface of the heat dissipation substrate 2. The plane of the heat dissipation substrate 2 is provided with grooves for installing the LED light strip 4, the lens 5 and the glass cover plate 6. The heat dissipation substrate 2 is in the shape of a cavity. At least the inner cavity of the heat dissipation substrate 2 is divided into two independent spaces to form a ventilation and heat dissipation channel. The present invention can be provided with a heat conduction groove 8 on the top of the heat dissipation substrate 2, and the heat conduction groove 8 di...

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Abstract

The invention relates to a heat dissipation assembly structure of an LED street lamp, which is composed of a baffle plate and a heat dissipation substrate. The heat dissipation substrate is semi-cylindrical. Cavity-shaped, with heat-conducting ribs in the cavity, the heat-conducting ribs at least divide the cavity into two independent spaces, when in use, according to the road conditions and power requirements, and then assembled into LED light-emitting components according to the above technical solutions, LED light-emitting The two ends of the components are equipped with baffles to form one or more LED light-emitting components into a lamp head. The light-emitting strips are arranged reasonably, and the brightness and spot patterns generated by the lamp head can enhance the air convection intensity during operation; The debris is removed under the action of natural wind or rain, which realizes and strengthens the heat dissipation effect of the heat dissipation base, and has the advantages of low cost, simple assembly process, flexible light distribution, and good heat dissipation effect.

Description

technical field [0001] The invention relates to the technical field of LED lamps, in particular to an LED street lamp heat dissipation assembly structure with good heat dissipation effect and long service life. Background technique [0002] As we all know, with the continuous innovation and development of science and technology. High-power LED light sources for semiconductor lighting will eventually completely replace traditional light sources. The performance and life are inversely proportional to the working junction temperature of the LED light source. Therefore, when in use, a good heat dissipation design is required to reduce the working temperature of the LED light source and then reduce its junction temperature. Street lamps need good airtightness in harsh outdoor environments To achieve the effect of waterproof and dustproof, this kind of airtight environment is not conducive to the heat dissipation of LED light source, thus affecting the performance and service lif...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/503F21V29/71F21V29/74F21V29/83F21W131/103F21Y115/10
CPCF21V29/503F21V29/713F21V29/74F21V29/83F21W2131/103
Inventor 史勇
Owner 史勇
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