GaN-based P-type grid-enhanced type HEMT device and preparation method thereof
An enhanced, gate technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve the problems of difficult to accurately control the area area, high cost, complex operation process, etc., to improve reliability, enhance Type characteristics, easy to achieve effect
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[0031] The GaN-based P-type gate enhanced HEMT device of the present invention, such as figure 1 As shown, including a substrate layer 1, a channel layer 2, a barrier layer 3, a gate 5 and a drain 6, the channel layer 2 is arranged above the substrate layer 1, and the barrier layer 3 is arranged above the channel layer 2 , the gate 5 is disposed above the barrier layer 3 , and the drain 6 is disposed on the barrier layer 3 .
[0032]The substrate layer 1 is made of silicon (Si), sapphire, silicon carbide (SiC), gallium nitride (GaN) or rare earth oxide and other materials suitable for growing III-V group compounds, and the thickness of the substrate layer 1 is 100 μm-1000 μm. The channel layer 2 is a GaN layer, and the thickness of the channel layer 2 is 0.1 μm-5 μm. The barrier layer 3 is an AlGaN layer, and the thickness of the barrier layer 3 is 0.2 μm-8 μm. The thickness of the gate 5 is 0.3nm-800nm.
[0033] The GaN-based P-type gate-enhanced HEMT device can be prepare...
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