Multi-chip multi-matching tiled sandwiched core package structure with partial framework exposed and process method of structure
A technology of flat sandwich and packaging structure, which is applied in semiconductor/solid-state device parts, electrical components, electric solid-state devices, etc. It can solve the problems of high equipment purchase cost, inability to form one piece, low manufacturing efficiency, etc., and achieve equipment saving The effect of purchase, reduction of interconnection process, and improvement of production efficiency
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[0060] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0061] As shown in Fig. 6(a) to Fig. 6(h), in this embodiment, a process method in which part of the frame is exposed, multi-chips and multi-layer tiled sandwich packaging structure, the specific process steps are as follows:
[0062] Step 1, see Figure 6(a), provide the first lead frame, the material of the first lead frame is alloy copper material, pure copper material, aluminum copper plated material, zinc plated copper material, nickel-iron alloy material, or other CTE The range is 8*10^-6 / ℃~25*10^-6 / ℃ conductive material;
[0063] Step 2. Referring to Figure 6(b), apply solder paste on the base island area of the first lead frame by screen printing. The purpose is to realize the bonding with the base island after the first chip is implanted. Thickness and opening area can precisely control the thickness, area and position of solder pas...
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