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Improved 3D printing photosensitive adhesive resin and preparation method thereof

A 3D printing and photosensitive adhesive technology, applied in adhesives and other directions, can solve the problems that 3D printing materials do not have night visibility, single color of 3D products, poor functionality, etc., and achieve the effect of fast curing speed, easy control and simple process

Inactive Publication Date: 2016-05-11
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the above-mentioned technical problems in the prior art, the present invention provides an improved resin for 3D printing photosensitive adhesive and its preparation method. The improved resin for 3D printing photosensitive adhesive and its preparation method should solve the existing The 3D printing glue in the technology needs to be heated during the molding process, which makes it inconvenient to use; and the formed 3D products have a single color, and the 3D printing materials made do not have the technical problems of poor night visibility and functionality

Method used

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  • Improved 3D printing photosensitive adhesive resin and preparation method thereof
  • Improved 3D printing photosensitive adhesive resin and preparation method thereof
  • Improved 3D printing photosensitive adhesive resin and preparation method thereof

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Embodiment 1

[0030] An improved resin for 3D printing photosensitive adhesive, calculated by parts by weight, its raw material composition and content are as follows:

[0031]

[0032] The polymerization inhibitor is a mixture of 2-tert-butyl hydroquinone and 2,5-di-tert-butyl hydroquinone in a mass ratio of 1:1; the catalyst is isopropyl chloride of chloroplatinic acid Alcoholic solution.

[0033] The above-mentioned preparation method of an improved 3D printing photosensitive adhesive resin specifically includes the following steps:

[0034] Add 10g of methyl hydrogen-containing silicone oil and 10g of dipentaerythritol hexaacrylate into a 500ml three-neck flask, then add 0.01g of hydroquinone, pass in protective gas, stir and heat, raise the temperature to 60°C, and add 0.01g of platinum chloride For the acid complex, keep the temperature constant for 3 hours under stirring, stop heating, wait until the temperature of the flask drops to room temperature, and obtain the resin for UV ...

Embodiment 2

[0039] An improved resin for 3D printing photosensitive adhesive, calculated by parts by weight, its raw material composition and content are as follows:

[0040]

[0041] The polymerization inhibitor is a mixture of hydroquinone and p-hydroxyanisole in a mass ratio of 1:2; the catalyst is a tetrahydrofuran solution of chloroplatinic acid.

[0042] The above-mentioned preparation method of an improved 3D printing photosensitive adhesive resin specifically includes the following steps:

[0043] Add 10g of methyl hydrogen-containing silicone oil and 10g of dipentaerythritol hexaacrylate into a 500ml three-neck flask, then add 0.01g of hydroquinone, pass in protective gas, stir and heat, raise the temperature to 60°C, and add 0.01g of platinum chloride For the acid complex, keep the temperature constant for 3 hours under stirring, stop heating, wait until the temperature of the flask drops to room temperature, and obtain the resin for UV curing LED encapsulation glue.

[0044...

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Abstract

The invention provides improved 3D printing photosensitive adhesive resin with the chemical structure shown in the formula (please see the formula in the description), and further provides a preparation method of the improved 3D printing photosensitive adhesive resin. The improved 3D printing photosensitive adhesive resin has rapid curing capacity after being used for coating and irradiated by a 385-nm UV-LED lamp and can be widely used for the technical fields of automobiles, industrial maintenance, medical treatment, originality and the like.

Description

technical field [0001] The invention belongs to the field of polymer materials and relates to an improved 3D printing photosensitive adhesive resin and a preparation method thereof. Background technique [0002] High-speed light-curing molding technology has been widely used in the world in recent years, especially 3D printing technology, which is a so-called additive molding technology that mainly manufactures three-dimensional products by adding materials layer by layer. It has low energy consumption, low cost, With the characteristics of high forming precision, it can print any complex parts that cannot be processed by traditional processing methods. There are still some problems in the development of the 3D printing photosensitive adhesive provided at present: the current 3D printing adhesive is mainly made of thermoplastic materials, such as PLA and ABS and other polymer materials, which need to be heated during the molding process, resulting in inconvenient use. In ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/38C09J183/06
CPCC08G77/38C09J183/06
Inventor 张英强常文秀李烨
Owner SHANGHAI INST OF TECH
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