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Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof

An integrated circuit and parallel seam welding technology, which is applied in the direction of circuits, electrical components, and electrical solid devices, can solve the hidden dangers of circuit application reliability and the difficulty of avoiding iron element exposure, etc., and achieve good salt spray corrosion resistance and meet The effect of application requirements in salt spray environment

Active Publication Date: 2018-02-23
WUXI ZHONGWEI GAOKE ELECTRONICS
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  • Abstract
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Problems solved by technology

[0005] The conventional parallel seam welding alloy cover plate adopts the overall electroless nickel plating process to form a nickel plating layer on the surface. The coating structure on the front and back sides is the same. Although the melting point of the coating is not high, overlapping solder joints are still formed on the front side during the parallel seam welding process. When the parallel seam welding current is high, it is difficult to avoid the exposure of the iron element in the substrate at the bottom of the coating, so the rust failure problem in the salt spray test occurs from time to time, which brings hidden dangers to the reliability of the circuit application

Method used

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  • Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof
  • Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof
  • Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof

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Embodiment Construction

[0038] The present invention will be further described below in conjunction with specific drawings.

[0039] Such as figure 1 As shown, the parallel seam welding alloy cover plate for integrated circuit packaging of the present invention includes an alloy cover plate body 1, and the outer surface of the front surface of the alloy cover plate body 1 is formed by an electroplating process to form a first electroplated nickel layer 2. The alloy cover plate The side outer surface of the plate body 1 is formed by an electroplating process to form a second electroplating nickel layer 3, and the reverse outer surface of the alloy cover plate body 1 is formed by an electroless plating process to form an electroless nickel plating layer 4, thereby forming a structure with different coating layers on the front and back surfaces. The alloy cover plate structure; the reverse side of the alloy cover plate body 1 is a welding surface, and a dot or other shape mark 5 is formed at the middle ...

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Abstract

The invention relates to a parallel seam welded alloy cover plate for integrated circuit packaging and a preparation method thereof, comprising an alloy cover plate body, characterized in that: the outer surfaces of the front and side surfaces of the alloy cover plate body are respectively formed with a first electroplated nickel layer and For the second electroplating nickel layer, an electroless nickel plating layer is formed on the reverse outer surface of the alloy cover body. The preparation method of the parallel seam welded alloy cover plate for integrated circuit packaging includes the following steps: coating the first resist coating on the front side of the alloy cover plate; electroless nickel plating on the reverse side of the alloy cover plate to form an electroless plating Nickel layer; remove the first resist coating; coat the second resist coating on the surface of the electroless nickel plating layer; cut the alloy cover plate into a single alloy cover plate; form the first plate on the front and side of the single alloy cover plate An electroplating nickel layer and a second electroplating nickel layer; removing the second resist coating on the surface of the electroless nickel plating layer. The invention satisfies the high reliability requirement of packaging devices by adopting parallel seam welding and sealing technology through different coating structures on the front and back sides.

Description

technical field [0001] The invention relates to a parallel seam welding alloy cover plate for integrated circuit packaging and a preparation method thereof, in particular to a cover plate used for hermetic packaging of ceramic and metal shells, and belongs to the technical field of integrated circuit manufacturing. Background technique [0002] Parallel seam welding is an important cover sealing technology for highly reliable integrated circuit hermetic packaging. This technology uses the principle of resistance welding to melt the coating on the opposite side of the cover plate through the heat generated by the roller electrode, so as to realize the welding between the cover plate and the sealing ring of the ceramic or metal shell. This kind of welding belongs to local welding. When the welding current passes through the contact between the electrode and the cover plate, and the contact between the cover plate and the sealing ring, enough heat is generated to melt the plati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/18H01L23/29
Inventor 张国华于宗光肖汉武
Owner WUXI ZHONGWEI GAOKE ELECTRONICS
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