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Cooling system for die

A cooling system and mold technology, which is used in the field of cooling systems for high-temperature resin and high-temperature carbon fiber molding molds, can solve the problems of mold deformation, slow heat removal, and difficulty in ensuring the dimensional accuracy and position accuracy of produced products.

Inactive Publication Date: 2016-04-20
STATE GRID CORP OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the actual process, the mold uses liquid (water) to cool down at high temperature, which easily deforms the mold and generates a large amount of superheated steam, making it difficult to guarantee the dimensional accuracy and position accuracy of the produced product, and this type of mold needs to be reduced to a very low level. Temperature range, while the liquid (water) takes away heat slowly, and it takes a long time to wait for the mold temperature to drop to the expected range

Method used

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  • Cooling system for die

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Embodiment Construction

[0009] The present invention is described in detail below in conjunction with accompanying drawing and embodiment:

[0010] Such as figure 1 As shown, a mold cooling system includes a high-pressure water source 1, a compressed air source 2, the high-pressure water source 1, and the compressed air source 2 are respectively connected to the control box 3 through pipelines, the high-pressure water source 1 is connected to the water tank 7 through the pipeline, and the water tank 7 is connected to the control box. The box 3 is connected, the control box 3 is connected with the flow equalizing valve 4 through the pipeline, the flow equalizing valve 4 is connected with the mold 5 through the pipeline, the mold 5 is connected with the one-way valve 6 through the pipeline, and the one-way valve 6 is connected with the control box 3 through the pipeline, Control box 3 is connected with water tank 7 by pipeline.

[0011] The present invention adopts normal temperature gas and liquid (w...

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Abstract

The invention specifically relates to a cooling system for a die, which belongs to the field of cooling systems. The cooling system for the die comprises a high pressure water source and a compressed air source, wherein the high pressure water source and the compressed air source are both connected with a control box; the high pressure water source is connected with a water tank; the water tank is connected with the control box; the control box is connected with a current equalizing valve; the current equalizing valve is connected with the die; the die is connected with a non-return valve; the non-return valve is connected with the control box; and the control box is connected with the water tank. The cooling system has the following advantages: latent heat of water is utilized, liquid gas absorbs considerable heat in the process of phase change, and high pressure air is cooperatively used to carry phase-changed water away so as to realize rapid cooling of the die and cleaning of a cooling medium in a cooling channel; thus, requirements for temperature control and rapid reduction of die temperature are met, die-opening efficiency is improved, and production power is enhanced.

Description

technical field [0001] The invention belongs to a cooling system, in particular to a cooling system for high-temperature resin and high-temperature carbon fiber molding dies. Background technique [0002] At present, in the production process of high-temperature resin and high-temperature carbon fiber material molding mold products, the cooling of the mold is one of the key factors affecting such material products. At present, liquid (water) cooling is mostly used, and the liquid cooling system is usually used to liquid-cool the upper and lower shells and cores. After the product is formed, inject liquid (water) into the water channel of the mold, and flow out through the water channel to reduce the temperature of the mold. After the mold drops to the required temperature range, the liquid (water) in the water channel of the mold is drained. [0003] In the actual process, the mold uses liquid (water) to cool down at high temperature, which easily deforms the mold and gener...

Claims

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Application Information

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IPC IPC(8): B29C43/52B29C70/54
Inventor 梅丰郎福堂刘京生赵成福王乔吴迪吴雪峰黄萌
Owner STATE GRID CORP OF CHINA
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