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Preparation method of crystallizer copper plate plated with ferro-nickel alloy layer

A technology of mold copper plate and nickel-iron alloy is applied in the field of mold copper plate preparation, which can solve the problems of affecting the amount of steel passing through the copper plate, affecting the production efficiency of a continuous caster, and accumulating internal stress in the coating layer, and achieving good thermal fatigue resistance. , The effect of reducing the probability of coating shedding and improving the leveling ability of the coating

Active Publication Date: 2016-04-13
JIANGSU BINXIN STEEL GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of continuous casting technology, copper plate electroplating technology develops rapidly: the coating material develops from simple metal to alloy material, from chromium to nickel to nickel-iron, nickel-cobalt alloy, and the coating form develops from composite layer to single layer. This functional electroplating Different from ordinary electroplating, the coating is relatively thick, usually with a thickness of 0.2mm-2mm, which inevitably leads to a large accumulation of internal stress in the coating. In the continuous casting production of copper plates, the coating working surface is in the environment of high-temperature molten steel and cooling water. Frequent alternation can induce cracks in the coating, and sometimes the coating will fall off, which affects the amount of steel passed through the copper plate and affects the production efficiency of the continuous casting machine
Moreover, there are many electroplating processes and the production cycle is long

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A method for preparing a mold copper plate plated with a nickel-iron alloy layer. The composition of the mold copper plate is: Ni: 1%; Be: 0.2%; Al: 0.5%, Zr: 5.0%; Mn: 1.2%; Mg: 3%; Cr: 0.8%; Zn: 16.0%; the rest is Cu; the preparation method includes preparing a crystallizer with a copper alloy having the above-mentioned composition, and electroplating a plating layer on the surface of the crystallizer, so that the The composition of the plating solution used in the electroplating is: nickel sulfate 220g / l, nickel chloride 19g / l, ferric sulfate 11.0g / l, boric acid 27g / l, potassium sulfate 5g / l, sodium chloride 40g / l, dodecyl sulfate Sodium alkyl sulfate 0.2g / l, additive 22ml / L, wherein the addition is a solution prepared by adding 10g sodium gluconate, 37g ascorbic acid and 22g dextrin to 1l water, and the process conditions are: pH value 2.3-3.5, current density 3.5A / dm 2 , the temperature is 44-46 ℃, and the plating thickness is 1.3mm.

Embodiment 2

[0014] A method for preparing a mold copper plate plated with a nickel-iron alloy layer. The composition of the mold copper plate is: Ni: 2%; Be: 0.05%; Al: 0.7%, Zr: 3.0%; Mn: 1.4%; Mg: 1%; Cr: 1.2%; Zn: 14.0%; the rest is Cu; the preparation method includes preparing a crystallizer with a copper alloy having the above-mentioned composition, and electroplating a plating layer on the surface of the crystallizer, so that the The composition of the plating solution used in the electroplating is: nickel sulfate 240g / l, nickel chloride 17g / l, ferric sulfate 13.0g / l, boric acid 23g / l, potassium sulfate 7g / l, sodium chloride 30g / l, dodecyl sulfate Sodium alkyl sulfate 0.4g / l, additive 20ml / L, wherein the addition is a solution prepared by adding 12g sodium gluconate, 33g ascorbic acid and 26g dextrin to 1l water, and the process conditions are: pH value 2.3-3.5, current density 4.5A / dm 2 , the temperature is 44-46 ℃, and the plating thickness is 1.5mm.

Embodiment 3

[0016] A method for preparing a crystallizer copper plate plated with a nickel-iron alloy layer, the composition of the crystallizer copper plate is: Ni: 1.5%; Be: 0.12%; Al: 0.6%, Zr: 4.0%; Mn: 1.3%; Mg: 2.0%; Cr: 1.0%; Zn: 15.0%; the rest is Cu; the preparation method includes preparing a crystallizer with a copper alloy having the above-mentioned composition, and electroplating a plating layer on the surface of the crystallizer, so that the The composition of the plating solution used in the electroplating is: nickel sulfate 230g / l, nickel chloride 18g / l, ferric sulfate 12.0g / l, boric acid 24g / l, potassium sulfate 6g / l, sodium chloride 35g / l, twelve Sodium alkyl sulfate 0.3g / l, additive 21ml / L, wherein the addition is a solution prepared by adding 11g sodium gluconate, 34g ascorbic acid and 24g dextrin to 1l water, and the process conditions are: pH value 2.3-3.5, current density 4A / dm 2 , the temperature is 44-46 ℃, and the plating thickness is 1.4mm.

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Abstract

The invention discloses a preparation method of a crystallizer copper plate plated with a ferro-nickel alloy layer. The crystallizer copper plate comprises the following components in percentage by mass: 1-2% of Ni, 0.05-0.2% of Be, 0.5-0.7% of Al, 3.0-5.0% of Zr, 1.2-1.4% of Mn, 1-3% of Mg, 0.8-1.2% of Cr, 14.0-16.0% of Zn, and the balance of Cu. The preparation method comprises the following steps: a copper alloy with the components is adopted to prepare a crystallizer; a plating layer is electroplated on the surface of the crystallizer; plating solution adopted by electroplating comprises the following components: 220-240 g / l of nickel sulfate, 17-19 g / l of nickel chloride, 11.0-13.0 g / l of ferric sulfate, 23-27 g / l of boric acid, 5-7 g / l of nickel chloride, 30-40 g / l of sodium chloride, 0.2-0.4 g / l of lauryl sodium sulfate, and 20-22 ml / L of additive, wherein solution prepared by adding 10-12 g of sodium gluconate, 33-37 g of ascorbic acid and 22-26 g of dextrin in 1 l of water is added; and the electroplating process has the following conditions: the PH value is 2.3-3.5; the current density is 3.5-4.5 A / dm2; the temperature is 44-46 DEG C; and the electroplating is performed until the thickness of the plating layer is 1.3-1.5 mm.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a preparation method of a crystallizer copper plate plated with a nickel-iron alloy layer. Background technique [0002] The mold copper plate is an important part of the continuous casting machine. The molten steel flows through the mold of the continuous casting machine and is cooled to form a billet. In the production process of continuous casting and drawing, the surface of the billet and the copper plate are in contact with each other to produce friction, and the surface of the copper plate is worn. Usually, functional electroplating technology is used to coat the surface of a layer of material with good thermal conductivity and wear resistance to reduce the surface of the copper plate. Wear, improve the repair times of copper plates, and prolong the service life of copper plates. With the development of continuous casting technology, copper plate electroplating tech...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22D11/059B22D11/057C22C9/04C25D3/56
CPCB22D11/057B22D11/059C22C9/04C25D3/56C25D3/562
Inventor 张颖
Owner JIANGSU BINXIN STEEL GRP
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