Preparation method of crystallizer copper plate plated with ferro-nickel alloy layer
A technology of mold copper plate and nickel-iron alloy is applied in the field of mold copper plate preparation, which can solve the problems of affecting the amount of steel passing through the copper plate, affecting the production efficiency of a continuous caster, and accumulating internal stress in the coating layer, and achieving good thermal fatigue resistance. , The effect of reducing the probability of coating shedding and improving the leveling ability of the coating
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0012] A method for preparing a mold copper plate plated with a nickel-iron alloy layer. The composition of the mold copper plate is: Ni: 1%; Be: 0.2%; Al: 0.5%, Zr: 5.0%; Mn: 1.2%; Mg: 3%; Cr: 0.8%; Zn: 16.0%; the rest is Cu; the preparation method includes preparing a crystallizer with a copper alloy having the above-mentioned composition, and electroplating a plating layer on the surface of the crystallizer, so that the The composition of the plating solution used in the electroplating is: nickel sulfate 220g / l, nickel chloride 19g / l, ferric sulfate 11.0g / l, boric acid 27g / l, potassium sulfate 5g / l, sodium chloride 40g / l, dodecyl sulfate Sodium alkyl sulfate 0.2g / l, additive 22ml / L, wherein the addition is a solution prepared by adding 10g sodium gluconate, 37g ascorbic acid and 22g dextrin to 1l water, and the process conditions are: pH value 2.3-3.5, current density 3.5A / dm 2 , the temperature is 44-46 ℃, and the plating thickness is 1.3mm.
Embodiment 2
[0014] A method for preparing a mold copper plate plated with a nickel-iron alloy layer. The composition of the mold copper plate is: Ni: 2%; Be: 0.05%; Al: 0.7%, Zr: 3.0%; Mn: 1.4%; Mg: 1%; Cr: 1.2%; Zn: 14.0%; the rest is Cu; the preparation method includes preparing a crystallizer with a copper alloy having the above-mentioned composition, and electroplating a plating layer on the surface of the crystallizer, so that the The composition of the plating solution used in the electroplating is: nickel sulfate 240g / l, nickel chloride 17g / l, ferric sulfate 13.0g / l, boric acid 23g / l, potassium sulfate 7g / l, sodium chloride 30g / l, dodecyl sulfate Sodium alkyl sulfate 0.4g / l, additive 20ml / L, wherein the addition is a solution prepared by adding 12g sodium gluconate, 33g ascorbic acid and 26g dextrin to 1l water, and the process conditions are: pH value 2.3-3.5, current density 4.5A / dm 2 , the temperature is 44-46 ℃, and the plating thickness is 1.5mm.
Embodiment 3
[0016] A method for preparing a crystallizer copper plate plated with a nickel-iron alloy layer, the composition of the crystallizer copper plate is: Ni: 1.5%; Be: 0.12%; Al: 0.6%, Zr: 4.0%; Mn: 1.3%; Mg: 2.0%; Cr: 1.0%; Zn: 15.0%; the rest is Cu; the preparation method includes preparing a crystallizer with a copper alloy having the above-mentioned composition, and electroplating a plating layer on the surface of the crystallizer, so that the The composition of the plating solution used in the electroplating is: nickel sulfate 230g / l, nickel chloride 18g / l, ferric sulfate 12.0g / l, boric acid 24g / l, potassium sulfate 6g / l, sodium chloride 35g / l, twelve Sodium alkyl sulfate 0.3g / l, additive 21ml / L, wherein the addition is a solution prepared by adding 11g sodium gluconate, 34g ascorbic acid and 24g dextrin to 1l water, and the process conditions are: pH value 2.3-3.5, current density 4A / dm 2 , the temperature is 44-46 ℃, and the plating thickness is 1.4mm.
PUM
Property | Measurement | Unit |
---|---|---|
softening point | aaaaa | aaaaa |
hardness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com