Undercoat used for base material with copper film, base material with copper film, manufacturing method for base material with copper film, and conductive film

A technology of copper thin film and primer, applied in the field of conductive film, can solve the problems of copper vapor deposition layer peeling, nickel lack of alkali resistance and acid resistance, falling off, etc., and achieve good alkali resistance and acid resistance adhesion, Excellent adhesion and scratch resistance

Active Publication Date: 2016-04-06
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, since nickel lacks alkali resistance and acid resistance in the above-mentioned copper vapor deposited plastic film, there are problems such as peeling and peeling of the copper vapor deposition layer from the base film after etching treatment.

Method used

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  • Undercoat used for base material with copper film, base material with copper film, manufacturing method for base material with copper film, and conductive film
  • Undercoat used for base material with copper film, base material with copper film, manufacturing method for base material with copper film, and conductive film
  • Undercoat used for base material with copper film, base material with copper film, manufacturing method for base material with copper film, and conductive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0102] Next, the present invention will be described in further detail by way of examples and comparative examples, however, the scope of the present invention is not limited by these examples. In addition, "part" in an Example shows a weight standard. In addition, the hydroxyl value is a value measured in accordance with JIS-0070. In addition, the glass transition temperature is a value measured using a commercially available measuring instrument (product name "DSC8230B", manufactured by Rigaku Electric Co., Ltd.).

[0103]

manufacture example 1

[0105] Into a reaction vessel having a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen introduction tube, 40.8 parts (13.6 mol %) of hydroxyethyl acrylate (HEA) as the component (a1) and 40.8 parts (13.6 mol %) as the component (a2) were mixed. 72.0 parts (about 27.7 mol%) of methyl methacrylate (MMA), 79.2 parts (about 23.8 mol%) of butyl acrylate (BA), 48.0 parts (34.9 mol%) of acrylonitrile (AN) as (a3) ​​component ) and 445.7 parts of ethyl acetate as the (G) component, and the reaction system was set at 70°C. Next, 1.2 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) (ABN-V) was mixed in, and it heat-retained at around 70 degreeC for 6 hours. Next, 2.4 parts of ABN-V was mixed in, and the reaction system was kept at the same temperature for another 6 hours. Thereafter, the reaction system was cooled to room temperature to obtain a solution of an acrylic acid copolymer (A-1) having a glass transition temperature of 13° C. and a hydroxyl value ...

manufacture example 2

[0107] In the same reaction vessel as in Production Example 1, 51.0 parts (13.3 mol %) of HEA as (a1) component, 72.0 parts (about 21.8 mol %) of MMA as (a2) component and 102.0 parts of BA ( About 24.1 mol %), 60.0 parts (about 34.3 mol %) of AN as (a3) ​​component, 15.0 parts (about 6.4 mol %) of acrylamide (AM) as (a4) component, and (G) component 557.1 parts of ethyl acetate, and the reaction system was set at 70°C. Next, 1.5 parts of ABN-V was mixed and kept at around 70°C for 6 hours. Next, 3.0 parts of ABN-V was mixed in, and the reaction system was further incubated at around the same temperature for 6 hours. Thereafter, the reaction system was cooled to room temperature to obtain a solution of an acrylic copolymer (A-2) having a glass transition temperature of 13° C. and a hydroxyl value of 80 mgKOH / g.

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Abstract

An objective of the invention is to provide an undercoat. The undercoat has excellent initial-stage adhesion, acid-resisting adhesion, and alkali-resisting adhesion with a base material and a copper film. The invention relates to an undercoat of a base material with a copper film. The undercoat contains acrylic copolymer (A) with hydroxyl, alkyl ester groups, nitrile groups, and required primary amide groups, polyisocyanates (B) at least containing three isocyanate groups, an active energy line aggregate compound (C) at least containing three carbon-carbon double bond groups, and a reactive alkoxy silyl group compound (D) represented by a formula (1): X1-Si(R1)a(OR2)3-A, wherein in the formula (1), X1 is a group containing the following functional groups, the functional groups react with at least a group selected from a group formed by hydroxyl, isocyanate groups, and groups containing polymeric carbon-carbon double bonds, R1 represents hydroxyl with 1-9 hydrogen or carbon number, R2 represents hydroxyl with 1-8 carbon number, and a represents 0, 1, or 2.

Description

technical field [0001] The present invention relates to a primer used to form a copper thin film on the surface of various substrates, a substrate having a copper thin film having a layer formed of the primer, a method for producing the same, and the use of the substrate having a copper thin film. formed conductive film. Background technique [0002] The "substrate having a copper thin film" in this specification means a product in which a copper thin film is formed on the surface of various substrates such as plastic moldings, plastic films, metals, glass, paper, nanofiber paper, and wood. Hereinafter, films having a conductive layer formed of a copper vapor-deposited film on the surface occupying a place as a substitute for a film having a conductive layer formed of indium tin oxide (ITO) on the surface (hereinafter referred to as an ITO film) are listed. (hereinafter referred to as "copper vapor deposition plastic film"), the background art will be described. [0003] I...

Claims

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Application Information

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IPC IPC(8): C09D175/04C09D7/12C08J7/04C23C14/20C23C14/22
Inventor 山崎彰宽东本徹近藤洋平
Owner ARAKAWA CHEM IND LTD
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