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Double processing head laser processing device based on radial polarization beams

A laser processing and processing head technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc. , processing efficiency, application scope limitations and other issues, to achieve the effect of small lateral size of focal spot, good processing effect and high beam quality

Inactive Publication Date: 2016-03-30
UNIV OF SHANGHAI FOR SCI & TECH
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  • Description
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Problems solved by technology

[0003] In the prior art, there are laser processing devices, see Italian PRIMA company laser cutting machine, Shenzhen Han's company laser welding machine and laser cutting machine, Wuhan Jinyun company's laser engraving and punching machine, Wuhan Chutian company, Wuhan unity, Huagong technology The laser processing devices of such companies are well used in many fields. These prior laser processing technologies have considerable advantages, but there are still some essential deficiencies: 1) The laser beam used by the laser processing device is linearly polarized light, circular Light field polarization modes such as polarized light do not give full play to the laser coherent light field vector optical focusing characteristics. The laser focal spot distribution for laser processing is beyond the diffraction limit size of ordinary optical focusing systems. Therefore, the lateral size of the focal spot for processing is large, and the focal spot The depth of focus is short, which significantly affects the realistic laser processing effect and application range; 2) There is a laser processing head in the processing system, so that the characteristics of device flexibility, processing efficiency, and application range are significantly limited; 3) It is essentially impossible to realize the laser processing head. Ultra-precision laser near-field processing after strong focusing on the polarization vector beam cannot realize near-field processing of super-diffraction size; 4) In essence, it is impossible to realize the longitudinally polarized laser processing light field, which limits the processing application of longitudinally polarized laser, and cannot realize polarization-sensitive Laser processing; 5) Prior art devices are limited in terms of flexibility, functional scalability, reliability, and simple structure, which affects the scope of prior art applications

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  • Double processing head laser processing device based on radial polarization beams

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with drawings and embodiments.

[0015] Such as figure 1 As shown, a laser processing device with dual processing heads based on radially polarized beams includes: a beam converging component 3, a high-reflection cavity mirror 4, a first reflector 5, a solid-state gain medium element 6, and a circular optical pumping source 7. The second reflector 8, the conical surface light field return element 9; the solid gain medium element 6 is a flat plate structure, and the optical working plane of the state gain medium element 6 has a high transmittance to the pump light wavelength light, and the solid gain medium A circular optical pumping source 7 is arranged outside the element 6, and the pumping light emitted by the circular optical pumping source 7 is irradiated in the solid gain medium element 6; one side of the solid gain medium element 6 is sequentially provided with a second A reflective mirror 5 and...

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Abstract

The invention relates to a double processing head laser processing device based on radial polarization beams. A circular optical pumping source is arranged outside a solid gain medium element; pumping light emitted by the circular optical pumping source illuminates the interior of the solid gain medium element; a first reflecting mirror and a high reflecting cavity mirror are sequentially arranged in an inner side optical path of the solid gain medium element; a second reflecting mirror and a circular conical surface optical field regulating element are sequentially arranged in an outer side optical path of the solid gain medium element; a beam convergence component is arranged in a optical path, opposite to the first reflecting mirror, of the high reflecting cavity mirror; the circular conical surface optical field regulating element realizes the effect of generating an intracavity radial polarization vector beam; and a parallel optical-axis optical field is reflected at a top end plane of the circular conical surface optical field regulating element, and a near field laser processing optical field is formed outside the top end plane of the circular conical surface optical field regulating element. The double processing head laser processing device has the characteristics that the double processing head laser processing device can realize the effects of super-diffraction size near field processing and longitudinal polarization laser processing, and is convenient to construct, high in reliability and flexibility, and wide in application range.

Description

technical field [0001] The invention relates to a laser processing device, especially a laser processing device with dual processing heads based on radially polarized beams, which is mainly used for laser processing in the fields of materials, automobiles, electronics, electrical appliances, aviation, metallurgy, machinery manufacturing, light industry, etc. device. Background technique [0002] Laser processing usually uses a high-power-density laser beam to irradiate the workpiece to melt and gasify the material for special processing such as perforation, cutting and welding. Recently, the concept of laser processing has been expanded. The interaction between the laser and the irradiated material causes the material to The processing that achieves the processing result by changing the characteristics (for example, the chemical bond of the material is broken under the laser irradiation, causing the material property to change), is also called laser processing. Therefore, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/064
CPCB23K26/0643B23K26/0652
Inventor 詹秋芳高秀敏张荣福
Owner UNIV OF SHANGHAI FOR SCI & TECH
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