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Production process for diodes

A production process and diode technology, applied in the field of diode production process, can solve the problems of copper ions not being able to be thoroughly cleaned, affecting chip corrosion rate, product electrical degradation, etc., to protect the environment and avoid electrical degradation. , Improve the effect of electrical yield

Inactive Publication Date: 2016-03-23
RUGAO DACHANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, diodes are soldered with chips, solder and leads at high temperature, and then acid-treated on the surface of the chips. However, during the pickling process, metal impurities in the solder and leads will react with the acid, affecting the corrosion rate of the chips. At the same time, The metal ions generated by the reaction of these metals with the acid will adhere to the surface of the chip, and a large amount of water and chemical reagents are required to clean in the subsequent process; this kind of cleaning not only consumes a lot of resources, but also the copper ions attached to the surface of the chip cannot be thoroughly cleaned, and will This will lead to failures such as electrical degradation of the product and thermal breakdown at high temperatures; in addition, it will also cause high metal content in the discharged cleaning solution, which will cause serious pollution to the soil after discharge

Method used

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  • Production process for diodes

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Embodiment 1

[0021] Such as figure 1 As shown, the production process of the diode in this embodiment includes five processes of pickling, electroplating, welding, insulation protection and post-treatment, and the specific steps are as follows:

[0022] (1) Pickling: Place the diode chip in a mixed solution of nitric acid and sulfuric acid with a volume ratio of 10:5 for acid corrosion. The corrosion time is 8 minutes, and the acid temperature is controlled between 5°C;

[0023] (2) Electroplating: The diode chip after pickling is electroplated to form a metal protective layer on the surface of the diode chip, and the thickness of the coating is 5 μm;

[0024] (3) Welding: Put the two metal lead electrodes, the soldering piece and the diode chip after electroplating into the fixture, send it to the welding furnace to heat up, the temperature is controlled at 300 ° C, and the welding time is 15 minutes, so that the diode chip is connected to the metal lead ;

[0025] (4) Insulation protec...

Embodiment 2

[0028] Such as figure 1 As shown, the production process of the diode in this embodiment includes five processes of pickling, electroplating, welding, insulation protection and post-treatment, and the specific steps are as follows:

[0029] (1) Pickling: Place the diode chip in a mixed solution of nitric acid and sulfuric acid with a volume ratio of 10:5 for acid corrosion. The corrosion time is 12 minutes, and the acid temperature is controlled between 0°C;

[0030] (2) Electroplating: The pickled diode chip is electroplated to form a metal protective layer on the surface of the diode chip, and the thickness of the coating is 3 μm;

[0031] (3) Welding: Put the two metal lead electrodes, the soldering piece and the diode chip after electroplating into the fixture, and send it to the welding furnace to heat up. The temperature is controlled at 290 ° C, and the welding time is 12 minutes, so that the diode chip is connected to the metal lead. ;

[0032] (4) Insulation protect...

Embodiment 3

[0035] Such as figure 1 As shown, the production process of the diode in this embodiment includes five processes of pickling, electroplating, welding, insulation protection and post-treatment, and the specific steps are as follows:

[0036] (1) Pickling: Place the diode chip in a mixed solution of nitric acid and sulfuric acid with a volume ratio of 10:5 for acid corrosion. The corrosion time is 10 minutes, and the acid temperature is controlled between 3°C;

[0037] (2) Electroplating: The pickled diode chip is electroplated to form a metal protective layer on the surface of the diode chip, and the thickness of the coating is 4 μm;

[0038] (3) Welding: Put the two metal lead electrodes, the soldering piece and the diode chip after electroplating into the fixture, and send it to the welding furnace to heat up. The temperature is controlled at 295 ° C, and the welding time is 13 minutes, so that the diode chip is connected to the metal lead. ;

[0039] (4) Insulation protect...

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Abstract

The invention relates to a production process for diodes. The production process comprises five steps of acid washing, electroplating, welding, insulation protection and post-treatment. The production process for the diodes has the advantages that the steps of acid washing, welding and welding are performed in sequence; a chip is subjected to acid corrosion before welding, so that solders and metal impurities in lead wires are prevented from reacting with an acid liquid to influence a corrosive rate of the chip in the acid washing process; metal ions generated by reaction of metal and acid are prevented from being adhered to the surface of the chip, so that large amounts of washing processes are removed and resources are saved; the faults such as electric degradation and high-temperature thermal breakdown of a product are avoided, so that the electric yield of the product is increased; and meanwhile, the metal content of a discharged washing liquid is reduced and the soil pollution is alleviated, so that the environmental protection is facilitated.

Description

technical field [0001] The invention relates to the technical field of diode production, in particular to a diode production process. Background technique [0002] Diode is one of the most commonly used electronic components. The biggest characteristic is unidirectional conduction, that is, current can only flow from one direction of the diode. The function of the diode is a rectifier circuit, a detection circuit, a voltage regulator circuit, and various modulation circuits It is mainly composed of diodes. [0003] As diodes are widely used in the market, their demand is also increasing. At present, diodes are soldered with chips, solder and leads at high temperature, and then acid-treated on the surface of the chips. However, during the pickling process, metal impurities in the solder and leads will react with the acid, affecting the corrosion rate of the chips. At the same time, The metal ions generated by the reaction of these metals with the acid will adhere to the sur...

Claims

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Application Information

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IPC IPC(8): H01L21/329
CPCH01L29/6609
Inventor 黄丽凤
Owner RUGAO DACHANG ELECTRONICS
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