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High-heat-conductive composition, preparation method and heat-conductive gasket thereof

A composition and high thermal conductivity technology, applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of high interface thermal resistance and poor dispersion, achieve high surface activity, good thermal conductivity, and reduce interface thermal resistance Effect

Inactive Publication Date: 2016-03-23
PINGHU ALLIED IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a high thermal conductivity composition and its preparation method and its thermal pad to solve the poor dispersion of nanoscale thermal conductive filler particles and the interface thermal resistance between the nanoscale thermal conductive filler particles and the metal-based thermal conductive filler particles in the existing thermal conductive interface materials. high problem

Method used

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  • High-heat-conductive composition, preparation method and heat-conductive gasket thereof
  • High-heat-conductive composition, preparation method and heat-conductive gasket thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] High thermal conductivity composition, including the following components in mass percentage: vinyl polydimethylsiloxane 4.7%, hydrogen-containing polydimethylsiloxane 4.3%, 40 μm alumina powder 47%, 5 μm alumina powder 42% , 50nm carbon nanotubes 1.99%, platinum catalyst 0.01%.

[0023] The preparation method of high thermal conductivity composition comprises the following steps:

[0024] Step 1: The heat-conducting powder is added to the fusion machine for fusion treatment. The speed of the fusion machine is 500rpm, the fusion time is 0.5h, and the process is water-cooled to obtain a composite heat-conducting filler;

[0025] Step 2: Add the above composite thermally conductive filler, vinyl polydimethylsiloxane and hydrogen-containing polydimethylsiloxane into the planetary disperser, stir and mix evenly, the speed of the planetary disperser is 5rpm-30rpm, and the stirring time is 10min ~30min, and then vacuumize to obtain the rubber.

[0026] The rubber compound p...

Embodiment 2

[0028] As for the high thermal conductivity composition described in Example 1, this example has the following differences: it includes the following components in mass percentage: vinyl polydimethylsiloxane 4.7%, hydrogen-containing polydimethylsiloxane 4.3%, 40μm zinc oxide powder 47%, 5μm alumina powder 42%, 50nm carbon nanotube 1.99%, platinum catalyst 0.01%.

[0029] The preparation method of high thermal conductivity composition comprises the following steps:

[0030] Step 1: The heat-conducting powder is added to the fusion machine for fusion treatment. The speed of the fusion machine is 1000rpm, the fusion time is 1.25h, and the process is water-cooled to obtain a composite heat-conducting filler;

[0031] Step 2: Add the above composite thermally conductive filler, vinyl polydimethylsiloxane and hydrogen-containing polydimethylsiloxane into the planetary disperser, stir and mix evenly, the speed of the planetary disperser is 5rpm-30rpm, and the stirring time is 10min ...

Embodiment 3

[0034] As described in the first and second embodiments, this embodiment has the following differences: it includes the following components in mass percentage: vinyl polydimethylsiloxane 4.7%, hydrogen-containing polydimethylsiloxane Oxane 4.3%, 40 μm alumina and zinc oxide powder 47%, 5 μm alumina powder 42%, 50nm carbon nanotube 1.99%, platinum catalyst 0.01%.

[0035] The preparation method of high thermal conductivity composition comprises the following steps:

[0036] Step 1: The heat-conducting powder is added to the fusion machine for fusion treatment. The speed of the fusion machine is 1500rpm, the fusion time is 2h, and the process is water-cooled to obtain a composite heat-conducting filler;

[0037] Step 2: Add the above composite thermally conductive filler, vinyl polydimethylsiloxane and hydrogen-containing polydimethylsiloxane into the planetary disperser, stir and mix evenly, the speed of the planetary disperser is 5rpm-30rpm, and the stirring time is 10min ~3...

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Abstract

The invention relates to a high-heat-conductive composition, which includes a polysiloxane substrate and a composite heat-conductive filling material which is prepared through a mechanical fusion method. The composition is prepared through fusion and stirring. The high-heat-conductive composition is prepared from the polysiloxane substrate, and the composite heat-conductive filling material which is prepared through the mechanical fusion method and includes a micron-scale heat-conductive powder, a nano-scale heat-conductive powder and / or a submicron-scale heat-conductive powder, wherein the nano-scale heat-conductive powder and the submicron-scale heat-conductive powder are large in surface area, high in surface energy and high in surface activity. By means of the mechanical fusion method, the nano-scale heat-conductive powder is fused with the micron-scale heat-conductive powder to prepare the composite heat-conductive filling material. The micron-scale heat-conductive powder and the nano-scale heat-conductive powder are fully dispersed and meanwhile interface heat resistance therebetween is greatly reduced. The heat-conductive performance of the nano-scale heat-conductive powder is fully achieved so that the high-heat-conductive composition is better in the heat-conductive performance.

Description

technical field [0001] The invention relates to the technical field of thermal interface materials, in particular to a high thermal conductivity composition, a preparation method and a thermal conduction pad. Background technique [0002] Thermally conductive interface material is a composite material formed by mixing powdery thermally conductive filler and resin matrix, and its thermal conductivity is mainly determined by the thermal conductivity and filling amount of the powdery thermally conductive filler. Thermally conductive fillers include nanoscale thermally conductive fillers and micronscale thermally conductive fillers. Micronscale thermally conductive fillers are generally metal or metal oxide powders, and nanoscale high thermally conductive fillers are mostly non-metallic powders such as graphene, carbon fiber, and boron nitride. Nanoscale thermally conductive fillers have the characteristics of large specific surface area, high surface energy and high surface act...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K13/04C08K3/22C08K7/24C08K7/06C08K3/38C09K5/14
CPCC08L83/04C08K2201/003C08K2201/011C08K2201/014C08L2205/025C09K5/14C08K7/24C08K2003/2227C08K2003/2296C08K13/04
Inventor 吴靖
Owner PINGHU ALLIED IND
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