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Intelligent wearable device

A wearable device and intelligent technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of unreached volume and reliability, and achieve the effect of light weight, low cost, and small volume

Inactive Publication Date: 2016-03-02
BIWIN STORAGE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the above-mentioned hardware volume and function limitations, its volume and reliability have not reached the level of satisfaction of the majority of users

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Please refer to figure 2 and image 3 Embodiment 1 of the present invention is a smart wearable device based on system-in-a-package. System-in-a-package (SIP for short) is to integrate various functional chips or bare wafers, including functional chips such as processors and memories, into In one package, the advantages of various chip resources and package interconnection can be flexibly utilized to maximize performance and reduce costs. By adopting advanced SiP packaging technology, not only makes the whole product smaller, but also has the advantages of wear resistance, corrosion resistance, acid and alkali resistance, ultraviolet resistance, waterproof and dustproof.

[0047] Such as figure 2 As shown, the smart wearable device of the present invention includes a system-in-package module, and the system-in-package module includes a substrate 21, an element layer 22 and an encapsulation layer 23, and the substrate material is BT resin, ceramics, glass, silicon wa...

Embodiment 2

[0058] Such as Figure 5 As shown, Embodiment 2 of the present invention adds an LED indicator light 26 on the basis of Embodiment 1, Figure 5 A schematic cross-section is shown, Figure 6 Shown is a front top view, other chips are not shown. After the encapsulation layer 23 is completed, the position of the LED indicator light is laser cut to form a window 25, the window 25 runs through the entire encapsulation layer, exposing the substrate surface, and the LED indicator light 26 is installed in the window, and the LED indicator light can be used as required. It is a single-color lamp bead, and it can also be a red, green and blue three-color lamp bead. In this embodiment, a white LED is preferred to provide an indication function for the system. The LED and the like are connected to the main control chip through the substrate circuit.

[0059] To sum up, the present invention applies SIP packaging technology to smart wearable products to give full play to its strengths a...

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Abstract

The invention discloses an intelligent wearable device. The intelligent wearable device comprises a system-level packaging module. The system-level packaging module comprises a substrate, a component layer and a packaging layer. The component layer is arranged on the surface of the substrate and comprises a storage chip, a main control chip and a power supply management chip. The packaging layer covers the component layer. The intelligent wearable device has the characteristics of small size, light weight, high reliability and long service life.

Description

technical field [0001] The invention relates to the field of electronic circuits, in particular to a smart wearable device. Background technique [0002] In recent years, the smart wearable device industry has been booming, and major hardware manufacturers have launched their own products. Smart wearable devices are the product of the combination of low-power hardware technology, embedded software technology, and precision manufacturing technology with the development of human science and technology. Smart wearable devices must also have the basic attributes of wearable devices, that is, the comfort that users usually wear. The comfort of wearing by the user determines that the smart wearable device must be small in size and light in weight. This requires the product to be small in size and powerful enough at the same time. How to achieve this goal is a question that major manufacturers have been thinking about. [0003] With the development of semiconductor application t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L23/28H01L23/31
CPCH01L25/00H01L23/28H01L23/31H01L23/3107
Inventor 孙日欣孙成思李振华罗裕毓
Owner BIWIN STORAGE TECH CO LTD
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