Device for heating preform bodies or flat or preformed semi-finished products from thermoplastic material
A technology for thermoplastic materials and preforms, applied in the field of equipment for heating preforms made of thermoplastic materials or flat or preformed semi-finished products, to achieve good release, improved process stability, and reduced heating energy.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0065] figure 1 A cross-sectional view of the apparatus for heating the preform 3 according to the present invention is shown, wherein the preform 3 is held between two coaxially arranged main bodies 1.0 and 2.0. As shown by detail A of the drawing, the body 1.0 has a first layer 1.1 and a contact layer 1.3. The first layer 2.1 and the contact layer 2.3 are also formed on the surface of the main body 2.0 which is disposed oppositely. Corresponding electric heating resistors in the form of conductor loops arranged in an area geometric manner are formed on each of the two first layers 1.1 and 2.1 of the main body 1.0 and the main body 2.0. Also, both the main body 1.0 and the main body 2.0 have contact elements (not shown) via which each of the heating resistors is independently connected to the power source 1.2 and the power source 2.2. When an adjustable current is applied to the heating resistors of the main body 1.0 and the main body 2.0, due to the corresponding geometrica...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
width | aaaaa | aaaaa |
width | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com