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Processing method for double-sided polished sapphire wafers

A sapphire wafer and processing method technology, applied in stone processing equipment, metal processing equipment, grinding/polishing equipment, etc., can solve the problems of affecting the processing and use of wafers, large sub-surface damage, low processing efficiency, etc. The effect of removing the amount, improving the utilization rate, and improving the processing efficiency

Active Publication Date: 2016-02-10
哈尔滨秋冠光电科技有限公司
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  • Summary
  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

[0004] The traditional mechanical grinding method has low processing efficiency, large sub-surface damage, and easy edge chipping, which seriously affects the subsequent processing and use of the wafer.

Method used

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  • Processing method for double-sided polished sapphire wafers
  • Processing method for double-sided polished sapphire wafers

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Embodiment Construction

[0020] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. But it does not constitute any limitation to the present invention.

[0021] to combine figure 1 , the present embodiment provides a method for processing a double-sided polished sapphire square wafer. The technological process of described method comprises:

[0022] P1, diamond multi-wire cutting: Paste sapphire block material (square with a cross-section of 52×52mm) on a fixed tooling, use a diamond wire saw with a diameter of 0.22mm to slice, and the median particle size of the diamond particles on the surface is 30-40nm , the thickness of the cut piece is the thickness of the final polished piece plus 0.08-0.1mm reserved for subsequent corrosion and polishing.

[0023] P2, Wafer annealing: Put the sapphire cutting piece into the high-temperatu...

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Abstract

The invention provides a processing method for double-sided polished sapphire wafers. The main technological process comprises the steps of multi-wire cutting, wafer annealing, wafer chemical wet etching, wafer periphery chamfering and wafer chemical-mechanical polishing. Since the sapphire wafers are processed through the method, the operation processes are simplified, operation is easier, and the processing cycle can be efficiency shortened. On the precise of guaranteeing the thickness and surface quality of the wafers, the reserved processing allowance for subsequent processing can be reduced in the slicing process, the utilization rate of crystals can be increased, and therefore the production and manufacturing cost of the sapphire wafers is reduced.

Description

(1) Technical field [0001] The invention relates to a processing method of a sapphire wafer, in particular to a processing method of a double-sided polished sapphire wafer used for window materials. (2) Background technology [0002] Sapphire single crystal has the characteristics of high hardness, good wear resistance, high brittleness, and stable chemical properties, so it is very difficult to process it precisely and ultra-precision. In order to obtain an ultra-smooth surface, the currently commonly used sapphire wafer surface processing process mainly adopts the method of mechanical grinding combined with chemical mechanical polishing. [0003] The purpose of mechanical grinding of sapphire wafers is to remove the surface / subsurface damage layer generated during the multi-wire cutting process, correct the geometric thickness of the wafer, and improve the flatness, roughness and warpage of the wafer surface. In order to improve the efficiency of wafer mechanical grinding...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04C30B33/02C30B33/10B24B9/16B24B37/04
Inventor 左洪波杨鑫宏张学军袁志勇
Owner 哈尔滨秋冠光电科技有限公司
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