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Porous ceramic connecting method

A technology of porous ceramics and connection method, which is applied in the field of ceramic connection, can solve problems such as complex process, achieve controllable carbon content, improve poor wettability, and increase joint strength

Active Publication Date: 2016-01-27
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problem that the existing porous ceramics and metals are connected during the process of achieving wettability improvement and thermal stress relief, and the process is complicated, and provides a porous ceramics connection method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0024] Specific implementation mode one: the porous ceramic connection method of this implementation mode is carried out according to the following steps:

[0025] 1. Preparation of phenolic resin organic solution

[0026] Weigh the water-soluble phenolic resin and solvent to prepare an organic solution with a volume concentration of 30% to 70%;

[0027] 2. Heat treatment of porous ceramics

[0028] After vacuum impregnating the porous ceramics in an organic solution, put them into an oven for pre-curing, wherein the vacuum impregnation time is 30-60 minutes, the oven temperature is 120-170°C, and the curing time is 1-24 hours;

[0029] The impregnated and solidified porous ceramics were placed in a vacuum sintering furnace until the vacuum degree reached 7.0×10 -2 Pa~1.5×10 -2 Pa, heat up to 900-1200°C at a heating rate of 15-30°C / min, and keep it warm for 10-30min, then turn off the power and naturally cool to room temperature to obtain heat-treated porous ceramics;

[0...

specific Embodiment approach 2

[0034] Embodiment 2: This embodiment is different from Embodiment 1 in that: in step 1, the solvent is acetone or methanol. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0035] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the volume concentration of the organic solution in step 1 is 40% to 60%. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a porous ceramic connecting method, relates to a ceramic connecting method, and aims to solve the problem that the process is complex when wettability is improved and thermal stress is relieved simultaneously when conventional porous ceramic is connected with metals. The porous ceramic connecting method comprises the following steps: I, preparing an organic phenolic resin solution; II, performing thermal treatment on porous ceramic; and III, connecting the porous ceramic. Due to a surface layer pore structure of the porous structure, a brazing filler metal can permeate into a base body to form a connecting structure with mechanical occlusion and chemical bond combination, not only is residual thermal stress of a connector effectively relieved, but also a boundary reaction combination area is increased, and the strength of the connector can be improved. The porous ceramic connecting method is applied to the field of connection of ceramic and metal materials.

Description

technical field [0001] The invention relates to a ceramic connection method. Background technique [0002] Due to the mismatch of thermal and physical properties between ceramics and metal materials, there are problems such as large residual stress in the connection between ceramics and metals, low joint strength or even ineffective connection. How to reduce the stress of connecting ceramics and metals is the key to obtain highly reliable ceramic / metal composite products. A large number of literatures have reported that by using the joint gradient powder method, composite solder method, soft or hard buffer layer method, porous material or metal fiber mesh buffer material method or processing holes, rectangular waves, triangular waves or sine waves on the ceramic surface, etc. The structure can alleviate the thermal stress after welding to a certain extent and improve the strength of the joint. Also, by sintering a layer of ceramic and metal composite layer structure on the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/83C04B37/02
Inventor 林铁松何鹏庄艳丽王胜金贾德昌
Owner HARBIN INST OF TECH
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