Ceramic/ceramic connection method for regulating and controlling middle solder layer through multi-physical-field coupling
A multi-physics field and connection method technology, applied in the field of material connection, can solve the problems of weld cracks, pores, glass brittleness, and insufficient mechanical properties of welded joints, etc., to eliminate weld defects, improve weld toughness, Effect of Reducing Residual Thermal Stress
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Embodiment 1
[0022] A ceramic / ceramic connection method for multi-physics field coupling and regulation of the intermediate solder layer, using a heat source to melt the solder or solder and part of the base material, while additionally applying a physical field, the steps are as follows:
[0023] 1) Cleaning of ceramic surface to be welded
[0024] Remove grease and stains from the surfaces of alumina ceramic sheets and silicon carbide ceramic sheets to be welded, pre-treat them with mechanical grinding, remove the oxide film initially, and then clean them with an ultrasonic cleaner;
[0025] 2) Preparation of solder
[0026] The solder is a mixed material of glass powder and silicon carbide whiskers, wherein the volume percentage of silicon carbide whiskers is 30%, and the mixed material of glass powder and silicon carbide whiskers is put into a ball mill and mixed evenly to make powdery solder;
[0027] 3) ceramic / ceramic connection
[0028] Place the composite solder prepared above b...
Embodiment 2
[0032] A ceramic / ceramic connection method for multi-physics field coupling and regulation of the intermediate solder layer, using a heat source to melt the solder or solder and part of the base material, while additionally applying a physical field, the steps are basically the same as in Example 1, the difference is: The base materials are alumina ceramic sheets and silicon nitride ceramic sheets.
[0033] The histograms without ultrasonic application and with ultrasonic application are similar to Example 1.
Embodiment 3
[0035] A ceramic / ceramic connection method for multi-physics field coupling and regulation of the intermediate solder layer, using a heat source to melt the solder or solder and part of the base material, while additionally applying a physical field, the steps are basically the same as in Example 1, the difference is: in the aluminum oxide In the mixed material solder used between the ceramic sheet and the silicon carbide ceramic sheet, the reinforcement phase silicon carbide is in the form of particles.
[0036] The histograms without ultrasonic application and with ultrasonic application are similar to Example 1.
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