Process for removing hot-dipped tin or electroplated tin on copper or nickel base material

A technology of electro-tin plating and hot-dipping, applied in the field of metal surface treatment, to achieve the effect of rich source of raw materials, good uniformity, and stable solution reaction

Active Publication Date: 2016-01-06
日照旭日电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Provide a removal solution for hot dipping or electroplating unqualified tin coating of packaged electronic components and its application process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] First, dissolve 300g / L ammonium bifluoride in water, then add 0.2L / L nitric acid, add 0.03L / L hydrogen peroxide, and then stir the solution evenly. Then put the copper-plated or nickel-plated electronic components on the surface into the solution in the form of a roller, a chemical reaction will occur, the tin plating on the surface will be removed quickly, and the electronic components can be restored after being rinsed with clean water. The electronic components processed by the invention have a recovery rate of 90 percent, and have no adverse effect on the quality of the electroplated nickel layer or the electroplated copper layer.

Embodiment 2

[0017] First, 500g / L of ammonium bifluoride was dissolved in water, then 0.4L / L of nitric acid was added, and 0.05L / L of hydrogen peroxide was added, and then the solution was stirred evenly. Then put the copper-plated or nickel-plated electronic components on the surface into the solution in the form of a roller, a chemical reaction will occur, the tin plating on the surface will be removed quickly, and the electronic components can be restored after being rinsed with clean water. The electronic components processed by the invention have a recovery rate of 90 percent, and have no adverse effect on the quality of the electroplated nickel layer or the electroplated copper layer.

Embodiment 3

[0019] First, dissolve 400g / L ammonium bifluoride in water, then add 0.3L / L nitric acid, add 0.04L / L hydrogen peroxide, and then stir the solution evenly. Then put the tin-plated electronic components with copper-plated or nickel-plated substrates into the solution in the form of a roller, a chemical reaction will occur, the tin plating on the surface will be removed quickly, and the electronic components can be restored after being rinsed with water. The electronic components processed by the invention have a recovery rate of 91 percent, and have no adverse effect on the quality of the electroplated nickel layer or the electroplated copper layer.

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PUM

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Abstract

The invention provides a process for removing hot-dipped tin or electroplated tin on a copper or nickel base material, and belongs to the technical field of metal surface treatment. The process is characterized in that a removing solution, comprising 300-500g/L of acid ammonium fluoride, 0.2-0.4g/L of nitric acid, 0.03-0.05g/L of hydrogen peroxide, and the balance pure water, is provided. The preparation process comprises the following steps: taking pure water which is predicated to prepare half the volume of the removing solution based on the aforementioned mixing ratio; adding the acid ammonium fluoride to the water with stirring until the acid ammonium fluoride is completely dissolved; adding the nitric acid to the solution with stirring; adding the hydrogen peroxide to the solution with stirring until the mixed solution is uniform so as to obtain the removing solution of the hot-dipped or electroplated tin. As the electronic component to be treated is positioned into the removing solution in a roller form, the tin layer on the surface of the electronic component can be quickly removed; residual removing solution on the electronic component with the tin removed can be cleaned through clean water, and then the electronic component can be dried. The process is mainly applied to removal of an unqualified hot-dipped or electroplated tin layer on the copper or nickel base material, can solve the problem that the existing removing solution damages the copper or nickel base material, and is beneficial for mass production.

Description

technical field [0001] The invention provides a process for removing tin by hot dipping or electroplating on a copper or nickel substrate, belonging to the technical field of metal surface treatment. Background technique [0002] Hot dip tin and electroplated tin have the characteristics of corrosion resistance, low melting point, high packaging stability, easy wave soldering and reflow soldering, etc., and have been widely used in the electronic packaging industry. Packaged electronic components are nickel-plated or copper-plated, iron-nickel alloy on the steel plate, and then hot-dip tin or electroplated tin on the nickel surface or copper surface. At present, the thickness of hot-dip tin for packaged electronic components is 2.0-3.0 μm; the thickness of electroplated tin for packaged electronic components is 5.0-8.0 μm. Hot-dip tin packaged electronic components often have uneven coating thickness after hot-dipping tin, and the uneven thickness of tin coating directly af...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/30
Inventor 贾志顺潘光慎牛治群
Owner 日照旭日电子有限公司
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