Etching agent for displaying solidification dendritic structures of middle-high grade non-oriented silicon steel as well as etching method
A technology of oriented silicon steel and dendrite structure, which is applied in the field of metallographic inspection and analysis, can solve the problems of dendrite morphology damage, long corrosion time, secondary dendrite damage, etc., and achieve the suppression of columnar crystal growth, simple operation procedures, and improvement. The effect of axial crystal ratio
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Embodiment 1
[0017] The chemical composition of 50W600 non-oriented silicon steel is shown in Table 1. Grind the solidified sample of 50W600 non-oriented silicon steel on 150#, 400#, 600#, 1000#, 2000# water sandpaper in sequence, and then polish it with 2.5 μm diamond grinding paste on the polishing machine until the surface of the sample is as smooth as a mirror surface, without Visible scratches. Rinse the surface with alcohol after polishing, and then dry it with a polisher to prepare for erosion. Add 1.5g of water-sealed picric acid of analytical grade (purity ≥ 99.8%) into a beaker filled with 35ml of distilled water, then add 0.4ml of hydrochloric acid, 0.3g of copper chloride and 0.5g of sodium dodecylbenzenesulfonate in sequence, Stir well. Heat the prepared etching solution on the heating furnace until the etching solution boils, then clamp the processed sample with tweezers, make the polished side face down, suspend it in the etching solution in the beaker, and heat it for 8 s...
Embodiment 2
[0021] The chemical composition of 50W310 non-oriented silicon steel is shown in Table 2. Grind the solidified sample of 50W310 non-oriented silicon steel on 150#, 400#, 600#, 1000#, 2000# water sandpaper in sequence, and then polish it with 2.5 μm diamond grinding paste on the polishing machine until the surface of the sample is as smooth as a mirror surface, without Visible scratches. Rinse the surface with alcohol after polishing, and then dry it with a polisher to prepare for corrosion. Add the water-sealed picric acid of 2.0 analytical purity (purity ≥ 99.8%) into a beaker filled with 50ml of distilled water, then add 0.6ml of hydrochloric acid, 0.5g of copper chloride and 1g of sodium dodecylbenzenesulfonate in sequence, and stir well . Heat the prepared etching solution on the heating furnace until the etching solution boils, then clamp the processed sample with tweezers, make the polished side face down, suspend it in the etching solution in the beaker, and heat it f...
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