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Method for preparing high-thermal-conductivity coating for aluminum-based copper-clad plate

An aluminum-based copper-clad laminate with high thermal conductivity technology, applied in the field of copper-clad laminates, can solve the problems of reduced withstand voltage, easy cracking, high brittleness, etc., to increase cladding, improve electrical insulation performance and withstand voltage performance, The effect of reducing microbubbles

Active Publication Date: 2015-12-30
GOLDENMAX INTERNATIONAL TECHNOLOGY (ZHUHAI) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, some resin film-like materials made by adding a large amount of heat-conducting materials have appeared. This kind of film-like material is not only brittle, but also has many micro-air gaps in the film layer, and it is easy to crack during PCB processing, which will cause LED During long-term use, the components fail due to the drop in withstand voltage

Method used

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  • Method for preparing high-thermal-conductivity coating for aluminum-based copper-clad plate
  • Method for preparing high-thermal-conductivity coating for aluminum-based copper-clad plate
  • Method for preparing high-thermal-conductivity coating for aluminum-based copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0027] The method for preparing a high thermal conductivity adhesive film for an aluminum-based copper-clad laminate provided in this embodiment includes the following steps:

[0028] (1) Provide raw materials for the following components:

[0029] material name

Mass (grams)

mass ratio

E type bisphenol A epoxy resin

60

11.25％

O-Cresol Novolak Epoxy Resin

30

5.62％

Bisphenol A Low Molecular Epoxy Resin

10

1.88％

Diaminodiphenylsulfone

25

4.69％

boron trifluoride monoethylamine

0.5

0.09％

silicone rubber

8

1.50％

Toluene

50

9.38％

dimethylformamide

25

4.69％

butanone

50

9.38％

Cyclohexanone

20

3.75％

acetone

10

1.88％

Aluminum oxide powder (1μm)

50

9.38％

Silicon carbide powder (3μm)

90

16.87％

Aluminum oxide powder (8μm)

100

18.75％

A silane coupling agent

...

example 2

[0044] The method for preparing a high thermal conductivity adhesive film for an aluminum-based copper-clad laminate provided in this embodiment includes the following steps:

[0045] (1) Provide raw materials for the following components:

[0046] material name

Mass (grams)

mass ratio

E type bisphenol A epoxy resin

85

16.14

O-Cresol Novolak Epoxy Resin

10

1.90

Bisphenol A Low Molecular Epoxy Resin

5

0.95

Diaminodiphenylsulfone

15

2.85

boron trifluoride monoethylamine

0.6

0.11

silicone rubber

3

0.57

Toluene

50

9.49

dimethylformamide

25

4.75

butanone

50

9.49

Cyclohexanone

20

3.80

acetone

10

1.90

Aluminum oxide powder (1μm)

60

11.39

Silicon carbide powder (3μm)

70

13.29

Aluminum oxide powder (8μm)

120

22.79

A silane coupling agent

3

0.57

...

example 3

[0061] The method for preparing a high thermal conductivity adhesive film for an aluminum-based copper-clad laminate provided in this embodiment includes the following steps:

[0062] (1) Provide raw materials for the following components:

[0063] material name

Mass (grams)

mass ratio

E type bisphenol A epoxy resin

70

12.94％

O-Cresol Novolak Epoxy Resin

25

4.62％

Bisphenol A Low Molecular Epoxy Resin

5

0.92％

Diaminodiphenylsulfone

20

3.70％

boron trifluoride monoethylamine

0.8

0.15％

silicone rubber

10

1.85％

Toluene

50

9.25％

dimethylformamide

25

4.62％

butanone

50

9.25％

Cyclohexanone

20

3.70％

acetone

10

1.85％

Aluminum oxide powder (1μm)

60

11.09％

Silicon carbide powder (3μm)

90

16.64％

Aluminum oxide powder (8μm)

100

18.49％

A silane coupling agent

...

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Abstract

The invention discloses a method for preparing a high-thermal-conductivity coating for an aluminum-based copper-clad plate. According to the method, the heat conductivity coefficient of the coating is made to be larger than 3.0 W / K.m by adding composite thermal conducting filler; meanwhile, various solvent systems with different boiling points are adopted, solvents volatilize in a gradient mode during drying of the coating, the number of microbubbles in the coating is reduced, and the electric insulation performance and voltage resistance of the coating are improved; furthermore, organic elastic resin and micromolecule resin are introduced into a resin system, so that the elasticity of the coating is improved, and the coating performance and wettability of resin on inorganic filler are improved.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a method for preparing a high thermal conductivity adhesive film for aluminum-based copper-clad laminates. Background technique [0002] Aluminum-based copper-clad laminates are widely used in high-power heating components due to their good heat dissipation performance. With the rapid development of green lighting technology and the maturity of LED technology, aluminum-based copper-clad laminates have become the preferred material for high-power LED substrate materials. The heat dissipation of aluminum-based copper-clad laminates directly affects the life and luminous efficiency of LED light-emitting components, and the heat dissipation of aluminum-based copper-clad laminates depends on the thermal conductivity of the insulating adhesive layer. Therefore, research on insulating materials with good thermal conductivity The adhesive system is the main way ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J163/00C09J163/04C09J11/06C09J11/04C09J11/08B32B37/12
Inventor 马憬峰
Owner GOLDENMAX INTERNATIONAL TECHNOLOGY (ZHUHAI) LTD
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