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Multi-scale combined method for improving high hard and brittle ceramic base material soldering connection strength

A connection strength, ceramic-based technology, applied in the direction of welding equipment, workpiece edge parts, manufacturing tools, etc., can solve the problems of thermal expansion coefficient difference, low joint strength, large residual stress, etc., and achieve less surface stress of the incision, processing efficiency and accuracy High, reduce the effect of residual stress

Active Publication Date: 2015-12-30
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of low joint strength, large residual stress and low reliability caused by the difference in thermal expansion coefficient between the ceramic base material and the metal in the existing ceramic base material brazing method, and to provide a multi-scale joint Method for Improving Brazing Connection Strength of High Hard and Brittle Ceramic Base Materials

Method used

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  • Multi-scale combined method for improving high hard and brittle ceramic base material soldering connection strength
  • Multi-scale combined method for improving high hard and brittle ceramic base material soldering connection strength
  • Multi-scale combined method for improving high hard and brittle ceramic base material soldering connection strength

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specific Embodiment approach 1

[0036] Specific implementation mode 1: This implementation mode is a multi-scale joint method for improving the brazing connection strength of high-hard and brittle ceramic-based materials, which is completed according to the following steps:

[0037] 1. Surface treatment of connecting surface of high-hard and brittle ceramic base material:

[0038] Using ultra-short pulse laser drilling technology to process blind holes in an array on the connecting surface of the high-hard and brittle ceramic base material, and obtain a high-hard and brittle ceramic base material with an array of blind holes on the connecting surface; Grinding the high-hard and brittle ceramic base material and connecting parts to obtain a bright connecting surface with an array of blind holes and bright connecting parts; use acetone to polish the bright connecting surface with an array of blind holes The brittle ceramic-based base material and the bright connecting piece are ultrasonically cleaned with acet...

specific Embodiment approach 2

[0063] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the ultrashort pulse laser described in step 1 is picosecond laser or femtosecond laser. Other steps are the same as in the first embodiment.

[0064] The picoseconds described in this implementation are 10 -12 second, femtosecond is 10 -15 second.

specific Embodiment approach 3

[0065] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the cross-section of the blind hole on the connection surface of the high-hard and brittle ceramic base material described in step 1 is circular or square, and the blind hole The cross-sectional shape of the hole can be adjusted depending on the shape of the laser spot. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention relates to a method for improving the ceramic base material soldering connection strength, in particular to a multi-scale combined method for improving the high hard and brittle ceramic base material soldering connection strength. The method solves the problems that a joint connected through an existing ceramic base material soldering method is low in strength and the residual stress is large and the reliability is low due to the thermal expansion coefficient difference of ceramic base materials and metal. The method comprises the steps of 1, surface treatment of a high hard and brittle ceramic base material connection surface, 2, solder powder preparation, 3, composite solder paste preparation, 4, coating and 5, vacuum soldering connection, so that a high-strength high hard and brittle ceramic base material soldered joint is obtained. The compression-shear resistant strength of the obtained high hard and brittle ceramic base material soldered joint is 105-196 MPa, and the strength of the soldered joint is improved by 115-275% compared with a soldered joint adopting a conventional straight interface and no wild phase.

Description

technical field [0001] The invention relates to a method for increasing the brazing connection strength of ceramic base materials. Background technique [0002] Ceramic-based materials have broad application prospects in many extremely harsh environments such as aviation and aerospace due to their excellent high-temperature comprehensive properties, and are the preferred materials for hot-end components today. However, due to the inherent high hardness and brittleness, it is difficult for significant dislocation movement to occur in the structure of ceramic-based materials, so it is difficult to obtain large-sized and complex-shaped structural parts, which greatly limits the application of ceramic materials. Therefore, the realization of ceramic materials themselves or Reliable connection with metal materials has become one of the key technologies for the application of ceramic materials. Generally, the active brazing method is used to realize the connection of ceramic-cera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23K1/19B23K1/20B23K33/00
CPCB23K1/008B23K1/19B23K1/20B23K33/00
Inventor 林铁松何鹏冯青华
Owner HARBIN INST OF TECH
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