Production method of sapphire touch screen panel
A production method, sapphire technology, applied in stone processing equipment, fine working devices, machine tools suitable for grinding workpiece edges, etc., can solve the problems of poor touch screen quality and low yield, and achieve good uniformity and wafer structure Effects of integrity, viscosity, and interfacial film property stabilization
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Embodiment 1
[0029] The production method of the sapphire touch screen panel of the present embodiment specifically includes the following steps:
[0030] Step 1. Crystal ingot; take the C-oriented sapphire crystal, and then use the rod-extracting machine to extract the rod, so as to obtain the C-oriented crystal ingot;
[0031] Step 2, crystal cutting: use diamond wire cutting equipment to cut the ingot, so as to obtain the wafer;
[0032] Step 3: Take the slice by laser; put the polished wafer into the laser cutting machine and pass through the protective gas, and cut the wafer into the corresponding size according to the requirement;
[0033] Step 4. Grinding; use a grinding machine to grind the wafer; when grinding, add grinding liquid, the grinding disc pressurizes the wafer to 0.022Mpa, and the speed of the grinding disc is 1200rpm / min; after the grinding is completed, clean it with absolute ethanol; The grinding liquid components include by weight percentage: 2% cubic boron nitride...
Embodiment 2
[0040] The production method of the sapphire touch screen panel of the present embodiment specifically includes the following steps:
[0041] Step 1. Crystal ingot; take the C-oriented sapphire crystal, and then use the rod-extracting machine to extract the rod, so as to obtain the C-oriented crystal ingot;
[0042] Step 2, crystal cutting: use diamond wire cutting equipment to cut the ingot, so as to obtain the wafer;
[0043] Step 3: Take the slice by laser; put the polished wafer into the laser cutting machine and pass through the protective gas, and cut the wafer into the corresponding size according to the requirement;
[0044] Step 4. Grinding; use a grinding machine to grind the wafer; when grinding, add grinding liquid, the grinding disc pressurizes the wafer to 0.02Mpa, and the speed of the grinding disc is 1000rpm / min; after the grinding is completed, clean it with absolute ethanol; The grinding liquid components include by weight percentage: 0.5% cubic boron nitrid...
Embodiment 3
[0050] The production method of the sapphire touch screen panel of the present embodiment specifically includes the following steps:
[0051] Step 1. Crystal ingot; take the C-oriented sapphire crystal, and then use the rod-extracting machine to extract the rod, so as to obtain the C-oriented crystal ingot;
[0052] Step 2, crystal cutting: use diamond wire cutting equipment to cut the ingot, so as to obtain the wafer;
[0053] Step 3: Take the slice by laser; put the polished wafer into the laser cutting machine and pass through the protective gas, and cut the wafer into the corresponding size according to the requirement;
[0054] Step 4. Grinding; use a grinding machine to grind the wafer; when grinding, add grinding liquid, the grinding disc pressurizes the wafer to 0.02Mpa, and the speed of the grinding disc is 1100rpm / min; after the grinding is completed, clean it with absolute ethanol; The grinding liquid components include by weight percentage: 1% cubic boron nitride ...
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