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Room temperature curing adhesive based on silazane and its modified polymer and its preparation method

A room temperature curing, polymer technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of high curing temperature of adhesives, limited power of curing equipment, insufficient curing depth, etc., to achieve High shear strength, good toughness, wide range of effects

Active Publication Date: 2018-03-16
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of the above analysis, the present invention aims to provide a room temperature curing adhesive based on silazane and its modified polymer and its preparation method, in order to solve the problem of curing the adhesive based on silazane and its modified polymer. Problems such as high temperature, single use and insufficient curing depth due to limited power of curing equipment

Method used

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  • Room temperature curing adhesive based on silazane and its modified polymer and its preparation method
  • Room temperature curing adhesive based on silazane and its modified polymer and its preparation method
  • Room temperature curing adhesive based on silazane and its modified polymer and its preparation method

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preparation example Construction

[0031] The preparation process of the binder is:

[0032] Add a certain amount of auxiliary filler to 100 parts of silazane and its modified polymer and mix it evenly, then add the corresponding curing agent, mix thoroughly and degas for 5-10 minutes, then it can be used as room temperature curing high temperature resistant adhesive , Curing at room temperature for 3-7 days.

[0033] Silazane and its modified polymers are converted into ceramic materials by pyrolysis at high temperature. They have excellent temperature resistance and oxidation resistance. It is precisely because of the excellent properties of the precursor polymer itself that it can be prepared by compounding the corresponding fillers. High temperature resistant adhesive.

Embodiment 1

[0036] Add 100 parts of polysilazane with a viscosity of 45000 centipoise, 5 parts of TDI, and 100 parts of SiO in the beaker 2 , 50 parts of ZrB 2 , 5 parts SiC, 15 parts TiC, 3 parts SiO 2 Chopped fiber, 5 parts Fe 2 O 3 As a pigment, it can be used to bond plastics, metals, graphite, ceramics and their composite materials after being thoroughly mixed. After curing at room temperature, the bonding performance is measured.

[0037] Table 1 shows the room temperature bonding strength of the polysilazane binder to metals, graphite, polymer materials, ceramics and composite materials.

[0038] Table 1 The bonding strength of organosilicon binders to metals, polymer materials, ceramics and composite materials

[0039]

Embodiment 2

[0041] According to the ratio of each component of the binder given in Table 2, the viscosity of the polyborosilazane polymer is 950 centipoise. After mixing and degassing, it is used as the binder of the graphite matrix material to make 5 sets of bonding parts were tested for room temperature and high temperature performance, and the results are shown in Table 3.

[0042] Table 2 Composition and ratio of binder

[0043]

[0044] Note: The viscosity of polyborosilazane polymer is 950 centipoise

[0045] Table 3 Shear strength of binder at room temperature and 1000℃

[0046]

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Abstract

The invention discloses a binder based on silazane and its modified polymer and a preparation method thereof. Silazane and its modified polymers provided by the present invention refer to polysilazane, polyborosilazane, polycarbosilazane, polysiloxysilazane and ceramic precursor polymers containing silicon-nitrogen bonds one or more of them. The silazane-based ceramic precursor polymer can be cured at room temperature under the action of isocyanate, and a room-temperature-cured high-temperature-resistant organic silicon adhesive is prepared by compounding corresponding fillers. This type of adhesive has high temperature resistance and still has considerable shear strength at 1000 °C. The binder of the invention has good thermal stability, mechanical properties and bonding performance, and its temperature resistance is better than that of phenolic resin; compared with the inorganic binder, it has good toughness.

Description

Technical field [0001] The invention relates to the technical field of high-temperature adhesives, in particular to a room temperature curing high-temperature resistant adhesive based on silazane and its modified polymers and a preparation method thereof. Background technique [0002] Silicone adhesives are widely used in aerospace, machinery manufacturing, electronics and chemical industries due to their heat resistance and corrosion resistance. However, in recent years, the temperature resistance of ordinary silicone adhesives has been unable to meet social needs. [0003] The ceramic precursor has attracted wide attention due to its technological characteristics of polymer materials and the excellent high temperature resistance of ceramic materials formed by pyrolysis. In addition to the properties of the above-mentioned ceramic precursors, silazanes and their modified polymers have polar silicon-nitrogen bonds that make them have good adhesion to various substrate materials. In...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/16C09J11/06C09J11/04
Inventor 罗永明王林曾凡徐彩虹
Owner INST OF CHEM CHINESE ACAD OF SCI
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