Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Organosilicon sealant for LED (light-emitting diode) packaging

A technology of sealant and silicone, applied in the direction of electrical components, circuits, semiconductor devices, etc.

Inactive Publication Date: 2015-12-02
BLUESTAR CHENGDU NEW MATERIALS
View PDF5 Cites 24 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention aims to solve the problem of organic silicon materials used in LED packaging in the prior art, and provides a silicone sealant for LED potting. The sealant machine has good comprehensive performance and is very suitable for LED potting

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A silicone sealant for LED potting, comprising the following raw materials in parts by weight:

[0028] A component

[0029] Divinyl Dimethicone silicone resin 15 parts

[0030] Platinum catalyst 2 parts

[0031] B component

[0032] Divinyl polydimethylsiloxane silicone resin 50 parts

[0033] 50 parts of methyl hydrogen polysiloxane

[0034] Reaction Inhibitor 2 parts

[0035] Fumed white carbon black 30 parts

[0036] Additive KH-5602 parts

[0037] TiO 2 20 servings.

Embodiment 2

[0039] A silicone sealant for LED potting, comprising the following raw materials in parts by weight:

[0040] A component

[0041] Divinyl Dimethicone silicone resin 25 parts

[0042] Platinum catalyst 6 parts

[0043] B component

[0044] Divinyl polydimethylsiloxane silicone resin 58 parts

[0045] 58 parts of methyl hydrogen polysiloxane

[0046] Reaction Inhibitor 8 parts

[0047] Fumed white carbon black 40 parts

[0048] Additive KH-56010 parts

[0049] TiO 2 25 servings.

Embodiment 3

[0051] A silicone sealant for LED potting, comprising the following raw materials in parts by weight:

[0052] A component

[0053] Divinyl Dimethicone silicone resin 20 parts

[0054] Platinum catalyst 4 parts

[0055] B component

[0056] Divinyl polydimethylsiloxane silicone resin 55 parts

[0057] 55 parts of methyl hydrogen polysiloxane

[0058] Reaction Inhibitor 5 parts

[0059] Fumed white carbon black 35 parts

[0060] Additive KH-5606 parts

[0061] TiO 2 22.5 servings.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an organosilicon sealant for LED (light-emitting diode) packaging, belonging to the technical field of organosilicon sealants. The organosilicon sealant comprises a component A and a component B. The component A comprises 15-25 parts of divinyl polydimethylsiloxane silicon resin and 2-6 parts of platinum catalyst. The component B comprises 50-58 parts of divinyl polydimethylsiloxane silicon resin, 50-88 parts of methylhydropolysiloxane, 2-8 parts of reaction inhibitor, 30-40 parts of fumed silica, 2-10 parts of additive KH-560 and 20-25 parts of TiO2. The vinyl silicon resin, hydrogen-containing silicon oil and tetramethyltetravinylcyclosiloxane are subjected to addition reaction under the condition of the platinum catalyst to prepare the organosilicon electronic packaging adhesive with favorable comprehensive properties. The sealant is very suitable for LED packaging.

Description

technical field [0001] The invention relates to a silicone sealant, more specifically, the invention relates to a silicone sealant for LED potting, which belongs to the technical field of silicone sealants. Background technique [0002] Addition-type liquid silicone rubber uses vinyl-containing organopolysiloxane as the base polymer and silicon-hydrogen bond-containing organopolysiloxane as the cross-linking agent. Under the action of a platinum catalyst, the addition process is carried out at room temperature or under heating. A silicone potting material with a wide range of uses prepared by Lianhe. The organosilicon potting material prepared by this mechanism has no small molecular substances released during vulcanization, its shrinkage rate is extremely low, the stress is small, the cross-linking structure is easy to control, and it is easy to produce high-purity, high-transparency, flame-retardant products, and does not It contains solvents, is non-corrosive, has good f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L83/07C08L83/05C08K13/02C08K3/36C08K3/22C08K5/549C08J3/24H01L33/56
Inventor 毛云忠曹先军王凤德赵奕崔晓静高川刘咏梅
Owner BLUESTAR CHENGDU NEW MATERIALS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com