Manufacturing process of crystal diode

Abstract

The invention relates to a manufacturing process of a crystal diode. The manufacturing process comprises the following steps: (S1) wafer cutting; (S2) wafer assembly, namely putting a wafer lead on a lead track, sequentially grabbing each wafer to put into the wafer lead, and cutting the wafer lead into wafer lead segments of 216-360 products through a segmentation machine, and sequentially putting the wafer lead segments into the lead box; (S3) wire soldering, namely transferring the lead box with the wafer lead segments into a work bench of a wire soldering machine, adjusting the power of the wire soldering machine to be 30-50mW, the pressure to be 250-350mN and the temperature to be 240-320 DEG C, putting each wafer lead segment in the lead box on the wire soldering machine for wire soldering, so as to obtain the wafers with pins; (S4) injection molding; (S5) electroplating; (S6) separating; (S7) testing; and (S8) band loading, namely loading the tested and qualified crystal diodes to a stripped carrier band with a band loading mechanism, and carrying out plastic packaging to obtain the product. The manufacturing process has the advantages that transportation is facilitated in the manufacturing process; the product quality is improved; and classified transportation or storage is facilitated.

Description

technical field [0001] The invention relates to the technical field of diode production, in particular to a manufacturing process of a crystal diode. Background technique [0002] In the electronics industry, diodes have become the basic components of various electronic products. Traditional diodes have a pin at each end. When using it, you need to insert the pins of the diode into the holes on the circuit board so that the diode can be fixed in the circuit. board. However, at present, electronic products such as telephones, televisions, fax machines, computers and their peripheral products all over the world are researched and developed with the goal of clearing and shortening the package. The circuit board technology mostly uses double-layer or multi-layer circuit board technology, but double-layer or Multi-layer circuit board technology cannot punch holes like traditional single-layer circuit boards, so the diode is required to be as small as possible. [0003] As the s...

AI Technical Summary

Problems solved by technology

However, at present, electronic products such as telephones, televisions, fax machines, computers and their peripheral products all over the world are researched and developed with the aim of clearing and shortening the package. The circuit board technology mostly uses double-layer or multi-layer circuit board technology, but double-layer or Multi-layer circuit board technology cannot punch holes like traditional single-layer circuit boards, so the diode is required to be as small as possible

[0003] As the size of the diode gradually decreases, its processing difficulty is also increasing, which greatly increases its production cost, and in the production process, due to its small size, it is very difficult to transfer between different sections. Classification and assembly of each diode component requires a lot of manpower and material resources

For the finished product, its volume is small, and it is inconvenient to transport and store