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OSP (organic solderability preservative) preimpregnation agent

A technology of prepreg and accelerator, which is applied in the direction of welding medium, welding/cutting medium/material, metal processing equipment, etc., and can solve problems such as difficult to ensure the appearance of printed circuit boards, limited service life of bath solution, Giavanni effect, etc. , to achieve the effect of ensuring shear strength and solder joint reliability, prolonging service life and reducing corrosion

Inactive Publication Date: 2015-11-25
东莞市富默克化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this technology, the service life of the bath solution is limited, it is not resistant to high temperature packaging process, and it needs to use organic solvents such as alcohols as co-solvents, which is easy to cause Galvani effect (Galvanic effect) under low pH conditions, and it is difficult to ensure a better printed circuit board. Exterior

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A kind of OSP presoaker, described OSP presoaker comprises the raw material of following components:

[0039] Cyclic ketones 30g / L

[0040] Amine compound 1g / L

[0041] water balance.

[0042] The structural formula of the cyclic ketone compound is:

[0043] , where n=1.

[0044] The amine compound is ethylenediamine.

Embodiment 2

[0046] A kind of OSP presoaker, described OSP presoaker comprises the raw material of following components:

[0047] Cyclic ketones 35g / L

[0048] Amine compounds 2g / L

[0049] water balance.

[0050] The structural formula of the cyclic ketone compound is:

[0051] , where n=2.

[0052] The amine compound is monoethanolamine.

Embodiment 3

[0054] A kind of OSP presoaker, described OSP presoaker comprises the raw material of following composition:

[0055] Cyclic ketones 40g / L

[0056] Amine compound 3g / L

[0057] water balance.

[0058] The structural formula of the cyclic ketone compound is:

[0059] , where n=4.

[0060] The amine compound is diethanolamine.

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Abstract

The invention relates to the technical field of printed circuit board shielded welding, in particular to an OSP (organic solderability preservative) preimpregnation agent. The OSP preimpregnation agent comprises 30 g / L-50 g / L of cyclic ketone compound, 1 g / L-5 g / L of amine compound and the balance water. According to the OSP preimpregnation agent, an active layer can be firstly formed on a copper surface, the forming speed of an organic solderability preservative film is increased, and the thickness of the organic solderability preservative film can be increased by more than 20% within the same reaction time. The OSP preimpregnation agent is alkaline preimpregnation treating agent liquid medicine with a higher pH value, corrosion to the copper surface can be reduced, the metal contamination speed of tank liquor is lowered, and the service life of the copper surface can be prolonged by one time. The galvanic effect can be avoided, and the good appearance of a printed circuit board can be ensured. The thickness of intermetallic compounds obtained after tin soldering can be lowered, and the shear strength of a welding connector and the reliability of welding points are guaranteed.

Description

technical field [0001] The invention relates to the technical field of soldering protection of printed circuit boards, in particular to an OSP prepreg. Background technique [0002] Nowadays, printed circuit boards are becoming lighter, thinner and shorter, and the circuits are getting denser, and the assembly of downstream parts often needs to be assembled in more than 3 times, and each assembly needs to go through high-temperature remelting, and some organic solder protection films cannot Resistant to more than 3 times of high temperature remelting, and printed circuit boards have long been troubled by the discoloration of gold fingers, chemical nickel gold pads, and gold plated gold surfaces of substrates after organic solder protection (OSP) treatment. The intermetallic compound (IMC) layer produced by solder is brittle, and too thick intermetallic compound (IMC) layer will reduce the shear strength of the solder joint, resulting in failure of solder joint reliability. ...

Claims

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Application Information

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IPC IPC(8): B23K35/362
CPCB23K35/362
Inventor 伊洪坤王维仁
Owner 东莞市富默克化工有限公司
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