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Roughening solution for diamond-copper composite material and its surface nickel plating method

A composite material, diamond technology, applied in the field of surface treatment of diamond-copper composite materials

Active Publication Date: 2017-12-08
SHENZHEN RUN SUN CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problems existing in the surface treatment of the above-mentioned existing diamond-copper composite materials, the present invention proposes a roughening solution for the diamond-copper composite material. To deal with the existing problem of copper bite reaction, it can also oxidize and dissolve the surface impurities of the diamond-copper composite material and adsorb various organic and inorganic substances, so that the surface of the diamond-copper composite material can be cleaned, roughened and hydrophilic, and the plating efficiency is improved. coverage efficiency and quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A roughening solution for diamond-copper composite materials, its preparation method is as follows: after mixing 1kg sodium nitrite, 5kg sodium hydroxide, 0.3kg triethanolamine, 0.2kg carbonamide peroxide and 93.2kg water, add 0.3kg Potassium ferrate is mixed evenly to obtain the coarsening liquid.

[0020] The method for plating nickel on the surface of a diamond-copper composite material comprises the following steps:

[0021] Put the diamond-copper composite material into the above-mentioned roughening solution for alkaline roughening, the reaction temperature is 40°C, and the reaction time is 30 minutes; then put the roughened diamond-copper composite material into a 10% by weight NaOH solution for alkaline Degreasing, reaction temperature 100°C, reaction time 10min, then wash the diamond-copper composite material with deionized water to neutrality; then put the diamond-copper composite material after pickling into the basic colloidal palladium activation solution f...

Embodiment 2

[0023] A roughening solution for diamond-copper composite materials, its preparation method is as follows: after mixing 5kg sodium nitrite, 6kg sodium hydroxide, 0.4kg monoethanolamine, 0.3kg carbonamide peroxide and 87.8kg water, add 0.5kg Potassium ferrate is mixed evenly to obtain the coarsening liquid.

[0024] The method for plating nickel on the surface of a diamond-copper composite material comprises the following steps:

[0025] Put the diamond-copper composite material into the above-mentioned roughening solution for alkaline roughening, the reaction temperature is 45°C, and the reaction time is 20 minutes; then put the roughened diamond-copper composite material into a 15% by weight NaOH solution for alkaline Degreasing, reaction temperature 100°C, reaction time 20min, then wash the diamond-copper composite material with deionized water until neutral; then put the pickled diamond-copper composite material into the saline-based colloidal palladium activation solution ...

Embodiment 3

[0027] A roughening solution for diamond-copper composite materials, its preparation method is as follows: after mixing 3kg potassium nitrite, 3kg potassium hydroxide, 0.5kg diethanolamine, 0.5kg carbonamide peroxide and 92.7kg water, add 0.3kg After the sodium ferrate is mixed evenly, the roughened solution is obtained.

[0028] The method for plating nickel on the surface of a diamond-copper composite material comprises the following steps:

[0029] Put the diamond-copper composite material into the above-mentioned roughening solution for alkaline roughening, the reaction temperature is 50°C, and the reaction time is 15 minutes; then put the roughened diamond-copper composite material into a 20% by weight NaOH solution for alkaline Degreasing, reaction temperature 100°C, reaction time 20min, then wash the diamond-copper composite material with deionized water until neutral; then put the pickled diamond-copper composite material into the saline-based colloidal palladium activ...

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Abstract

The present invention proposes a roughening solution for diamond-copper composite materials and a surface nickel plating method thereof. The roughening solution is calculated by weight percentage and consists of the following components: 1-10% nitrite, 1-10% strong alkali, 0.2‑0.6% alcoholamine, 0.1‑0.8% carboamide peroxide, 0.1‑0.6% ferrate and 78‑97.6% water. The method for surface nickel plating is to carry out roughening, degreasing, activation, pickling and electroless nickel plating on the surface of the diamond-copper composite material in sequence. The roughening solution adopts the mixture of strong oxidant and strong alkali, which solves the problem of copper bite reaction existing in the traditional acidic roughening solution, and can oxidize and dissolve the surface impurities of the diamond-copper composite material and adsorb various organic and inorganic substances, thereby The surface of the diamond-copper composite material can be cleaned, roughened and hydrophilic, and the plating efficiency and quality are improved.

Description

technical field [0001] The invention belongs to the technical field of surface treatment of diamond-copper composite materials, and in particular relates to a roughening solution for diamond-copper composite materials and a surface nickel plating method thereof. Background technique [0002] Diamond-copper composite material not only has good thermal conductivity and electrical conductivity of copper matrix, but also can give full play to the high thermal conductivity and low thermal expansion performance of diamond particles. It is an ideal high thermal conductivity and low expansion electronic packaging material. The thermal expansion coefficient of the diamond-copper composite material can be adjusted by controlling the diamond content, and the thermal expansion coefficient can be completely matched with semiconductor materials such as Si and GaAs in practice. Therefore, the diamond-copper composite material is a new type of electronic packaging material with very broad ap...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/18
Inventor 帅和平刘开喜杨红
Owner SHENZHEN RUN SUN CHEM TECH
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