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On-chip power source noise peak value measurement system suitable for integrated circuit chip and measurement method of measurement system

A technology of power supply noise and integrated circuits, applied in the field of measurement systems for real-time detection of power supply noise peaks on-chip, can solve problems such as slow measurement rate, no power supply noise peaks involved, high power consumption, etc., achieve low measurement accuracy and avoid abnormal power consumption , The effect of low system power consumption

Active Publication Date: 2015-11-11
BEIHANG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] After searching the existing technical literature, it was found that Z.Abuhamdeh, etc. published "Separating temperature effects from ring-oscillator rdading to measure true air-droponachip (removing the influence of temperature on the ring oscillator to detect on-chip IR-Drop noise)" at the IEEE International Test Conference (International Test Conference) in 2007. A method of detecting power supply noise by detecting the frequency change of the ring oscillator is proposed, but this method can only give the average power supply noise over a period of time, and does not involve the peak value of the power supply noise
In 2005, T.Okumoto and others published "Abuilt-intechniqueforprobingpower-supplynoisedistributionwithinlarge-scaledigitalintegratedcircuits (a technology built into large-scale integrated circuits for detecting power supply noise distribution)" on the IEEE Journal of Solid-State Circuits (Journal of Solid-State Circuits), and proposed the A method of using AD sampling method to obtain the instantaneous noise of the power supply, usually the sampling frequency should be several times the system clock frequency, which will cause a large power consumption, and it is difficult to generate such a high frequency on the chip
[0012] Although the above literature uses an on-chip measurement system, the measurement accuracy of the power supply noise peak is low, the power consumption is large during operation, and the measurement rate is slow

Method used

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  • On-chip power source noise peak value measurement system suitable for integrated circuit chip and measurement method of measurement system
  • On-chip power source noise peak value measurement system suitable for integrated circuit chip and measurement method of measurement system
  • On-chip power source noise peak value measurement system suitable for integrated circuit chip and measurement method of measurement system

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Experimental program
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Effect test

Embodiment 1

[0184] The test carried out by applying the power supply noise peak measurement module designed by the present invention:

[0185] HSPICE software (version 2008 and above) is used for testing. This test uses the Nangate45nm open source library to add noise to the power supply network. The reference power supply voltage is 1.20V, the noise peak value is 1.17V, and the noise influence time is 1ns. First generate a digital signature lookup table. After that, the power supply plus noise is tested, and the simulation results are as follows: Figure 3D with Figure 3E ( Figure 3E yes Figure 3D As shown in the color display), when the noise comes, the measurement module responds quickly. As the voltage of the power supply network drops, the fourth inverter, the fifth inverter and the sixth inverter successively flip over, making the fourth The output of the first-level trigger units of the group flip-flops, the fifth group of flip-flops, and the sixth group of flip-flops change...

Embodiment 2

[0193] The test carried out by applying the power supply noise peak adjustment module designed by the present invention:

[0194] Use HSPICE software (version 2008 and above) to test, the power supply voltage without noise in this test is 1.20V, and the power supply voltage drops to 1.08V due to noise.

[0195] When there is no noise in the power supply, the output of the delay-sensitive path tested is as follows Figure 4AShown by the black line segment; when the power supply contains noise, apply the same input to the input end of the path, if the adjustment measures of the present invention are not taken, its output is as follows Figure 4B As shown, it is obvious that an error has occurred in its output; the path is adjusted using the present invention, and its output is as follows Figure 4C shown.

[0196] through Figure 4C and Figure 4A In contrast, the high and low level logics of the two are the same at the same sampling time, and the reason why the output wavef...

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Abstract

The invention discloses an on-chip power source noise peak value measurement system suitable for an integrated circuit chip and a measurement method. According to the power source noise peak value measurement system, digital signatures can be generated through resistor voltage division, inverter amplification and trigger sampling, so that power source noise peak values at various regions on a power source network on the integrated circuit chip can be measured in real time; and an adaptive control module is used in cooperation, so that adjustment processing can be performed on the measured peak values, and therefore, influence of power source noises on the performance of the integrated circuit chip can be decreased. The power source noise peak value measurement system of the invention has the advantages of high measuring accuracy and little influence on the chip. The power source noise peak value measurement system can be independently used for monitoring or testing the chip so as to reduce the interference of the power source noises to the chip.

Description

technical field [0001] The invention relates to a system for measuring power supply noise, more precisely, it is a measurement system suitable for on-chip real-time detection of power supply noise peak value on an integrated circuit chip. Background technique [0002] An integrated circuit (integrated circuit) is a tiny electronic device or component. Using a certain process, the transistors required in a circuit (the transistors are the main devices in the gate circuit), resistors, capacitors, inductors and other components and wiring are interconnected together to make a small or several small semiconductor wafers Or on a dielectric substrate, and then packaged in a package to become a microstructure with the required circuit functions; all the components have been structurally integrated, making electronic components towards miniaturization, low power consumption, intelligence and high A big step forward in terms of reliability. According to their different functions an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/40G01R29/26
Inventor 王晓晓张东嵘苏东林
Owner BEIHANG UNIV
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