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Method for preparing local soft solder coating on surface of aluminum alloy

A technology of aluminum alloy surface and solder, applied in the field of materials, can solve the problems of pollution, low potential of aluminum electrodes, easy bubbling, etc., and achieve the effects of reducing production cost, reducing production cycle and simple preparation process

Inactive Publication Date: 2015-11-04
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. Aluminum is a relatively active metal with a great affinity for oxygen, and it is easy to form a natural oxide film. The existence of the oxide film reduces the binding force with the coating
[0004] 2. The electrode potential of aluminum is low When immersed in the electroplating solution, it can undergo substitution reactions with various metal ions, and form a contact coating on the aluminum surface, reducing the bonding strength between the electroplating layer and the substrate
[0005] 3. Aluminum is an amphoteric metal, soluble in acid and alkali, and unstable in acidic or alkaline metal plating solutions
[0006] 4. Aluminum alloy castings have blisters and pores, which will leave plating solution and hydrogen gas, which is easy to bubble, and will also reduce the bonding force between the coating and the substrate
The electroplating process needs to electroplate the entire aluminum component, which increases the cost of electronic manufacturing, wastes energy and raw materials, and causes unnecessary pollution to the environment.
So far, there is still no feasible tinning process that can achieve local tinning or soldering on the surface of aluminum alloys with high efficiency, low cost and no pollution.

Method used

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  • Method for preparing local soft solder coating on surface of aluminum alloy
  • Method for preparing local soft solder coating on surface of aluminum alloy
  • Method for preparing local soft solder coating on surface of aluminum alloy

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Experimental program
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Effect test

specific Embodiment approach 1

[0028] Such as figure 1 As shown, the local coating of aluminum or aluminum alloy in this embodiment is realized according to the following steps: 1. After decontaminating and cleaning the parts of the aluminum alloy that need to be coated, lay tin foil with an area of ​​15×15 mm and a thickness of 300 μm on the surface. 2. Place the titanium-based alloy ultrasonic transmission medium (the lower surface area is 20×20mm) connected to the ultrasonic welding head on the tin foil and heat it to 250°C. 3. Apply a longitudinal ultrasonic wave with a frequency of 30 kHz and an amplitude of 5 μm. After ultrasonic treatment for 15 s, remove the ultrasonic conducting medium, use hot air leveling equipment to remove excess tin, and place the aluminum alloy in air to cool to room temperature.

[0029] Macroscopically inspect the coating, and the coating surface is clean and free of voids. Through EDS line scanning, it can be seen that tin and aluminum alloy form a good metallurgical bond...

specific Embodiment approach 2

[0030] Such as figure 2 As shown, the local coating of aluminum or aluminum alloy in this embodiment is realized according to the following steps: 1. After decontaminating and cleaning the parts of the aluminum alloy that need to be coated, lay tin foil with an area of ​​25×25 mm and a thickness of 300 μm on the surface. 2. Place the ceramic ultrasonic conducting medium (the lower surface area is 10×10mm) connected with the ultrasonic welding head on the tin foil and heat it to 250°C. 3. Apply a longitudinal ultrasonic wave with a frequency of 30kHz and an amplitude of 5μm. After ultrasonic treatment for 10s, move the ultrasonic device in parallel at a speed of 0.05m / min, so that the ceramic medium can cover the entire area to be plated at a slow speed, and stay in the final position for 10s. . Remove the ultrasonic conductive medium, use hot air leveling equipment to remove excess tin and place the aluminum alloy in air to cool to room temperature.

specific Embodiment approach 3

[0031] The difference between this embodiment and the first embodiment is that a longitudinal ultrasonic wave with a frequency of 20 kHz and an amplitude of 10 μm is applied, and the ultrasonic treatment is performed for 8 s. Other steps and parameters are the same as in the first embodiment.

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Abstract

The invention relates to a method for preparing a local soft solder coating on the surface of aluminum alloy in the atmospheric environment under the low-temperature condition. According to the method, the local soft solder coating on the surface of aluminum or on the surface of aluminum alloy is prepared in the atmospheric environment under the low-temperature condition through the function of the ultrasonic phonochemistry. By the adoption of the method, the defect that a soft solder wetting coating on the surface of aluminum or the surface of aluminum alloy cannot be prepared easily is overcome. Compared with other coating techniques such as electroplating, the method has the advantages that the technique is simple; the manufacturing cost is low; no pollution is generated; and the local coating can be formed within an extremely short period of time.

Description

technical field [0001] The invention belongs to the technical field of materials, in particular to a method for preparing a local solder coating on the surface of an aluminum alloy. Background technique [0002] Aluminum alloy has the advantages of small specific gravity, good thermal conductivity, and high cost performance. In the electronics industry, it mainly plays the role of mechanical support, electrical signal transmission, heat dissipation, electromagnetic field shielding, and circuit protection. In recent years, due to the continuous rise in copper prices, some copper components have gradually been replaced by aluminum alloys. From the perspective of manufacturing electronic products, aluminum alloys are required to have good weldability. The soldering solder commonly used in electronic packaging is difficult to wet and spread on aluminum alloys. Therefore, in the electronics manufacturing industry, the solderability of aluminum alloy components is improved by ele...

Claims

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Application Information

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IPC IPC(8): B23K1/06B23K1/20B23K35/26B23K103/10
CPCB23K1/06B23K1/20B23K35/26B23K1/206B23K35/262B23K2103/10
Inventor 李明雨杨海峰杨世华苗峻
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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