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Blackened surface-treated copper foil, manufacturing method of blackened surface-treated copper foil, copper-clad laminate, and flexible printed circuit board

A surface treatment and flexible printing technology, applied in the directions of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of inability to obtain fine-pitch circuit formation performance, difficulty in ensuring light transmittance, etc., to shorten the time of over-etching, The effect of the best etching coefficient and good etching characteristics

Active Publication Date: 2018-08-24
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the present invention, the glossiness [Gs(60°)] is 70 or more, and when the glossiness is lower than 70, good fine-pitch circuit formation performance cannot be obtained, and it is difficult to ensure the required performance when detecting with an automatic optical inspection device (AOI device). Good Light Transmittance" Technical Matters

Method used

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  • Blackened surface-treated copper foil, manufacturing method of blackened surface-treated copper foil, copper-clad laminate, and flexible printed circuit board
  • Blackened surface-treated copper foil, manufacturing method of blackened surface-treated copper foil, copper-clad laminate, and flexible printed circuit board
  • Blackened surface-treated copper foil, manufacturing method of blackened surface-treated copper foil, copper-clad laminate, and flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] In Example 1, blackened surface-treated copper foil was produced by performing black roughening, antirust treatment, and silane coupling agent treatment after producing an electrolytic copper foil with a thickness of 12 μm, and compared it with a comparative example described later.

[0053] Manufacture of electrolytic copper foil: Copper electrolyte uses sulfuric acid copper sulfate solution with the following composition, cathode uses titanium rotating electrode with surface roughness Ra=0.20μm, anode uses DSA, at solution temperature 45 ° C, current density 55A / dm 2 Electrolysis was performed to obtain an electrolytic copper foil having a thickness of 12 μm. The maximum height difference (Wmax) of the undulation of the deposition surface of this electrolytic copper foil was 0.8 micrometers.

[0054] Copper concentration: 80g / L

[0055] Free sulfuric acid concentration: 140g / L

[0056] Concentration of bis(3-sulfopropyl)disulfide: 30mg / L

[0057] Diallyldimethylam...

Embodiment 2

[0069] In Example 2, after producing an electrolytic copper foil with a thickness of 12 μm, the same black roughening, antirust treatment, and silane coupling agent treatment as in Example 1 were performed to produce a blackened surface-treated copper foil.

[0070] Manufacture of electrolytic copper foil: with the bis(3-sulfopropyl) disulfide concentration of embodiment 1 changed to the sulfuric acid copper sulfate solution of 20mg / L as copper electrolytic solution, obtained under the same conditions as embodiment 1 Electrolytic copper foil with a thickness of 12 μm. The maximum height difference (Wmax) of the undulation of the deposition surface of this electrolytic copper foil was 1.2 micrometers.

[0071] Using the above-mentioned electrolytic copper foil, the same black roughening, antirust treatment, and silane coupling agent treatment as in Example 1 were performed to obtain the blackened surface-treated copper foil of Example 2. Each characteristic evaluated is shown ...

Embodiment 3

[0073] In Example 3, blackened surface-treated copper foil was produced by performing black roughening, antirust treatment, and silane coupling agent treatment using the same electrolytic copper foil as in Example 1. Hereinafter, only black roughening which is different from Example 1 will be described.

[0074] Black roughening: Pre-roughening treatment was given to the deposition surface side among the electrode surface and the deposition surface which the above-mentioned electrolytic copper foil has. The pre-roughening treatment at this time is performed in the following two steps.

[0075] In the first stage of pre-roughening treatment, use a copper electrolytic solution for roughening treatment with a copper concentration of 18g / L and a free sulfuric acid concentration of 70g / L, at a solution temperature of 25°C and a current density of 4A / dm 2 Wash with water after 4 seconds of electrolysis. Subsequently, in the second stage, using a copper electrolytic solution with a...

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Abstract

The object of the present invention is to provide a copper foil for a printed wiring board, which has a blackened surface that can improve the visibility of the CCD in the terminal connection process and the detection accuracy of the AOI of the flexible printed wiring board. Appropriate roughness for flexible printed circuit board manufacturing, and has good etching properties. In order to achieve this object, the present invention adopts a blackened surface-treated copper foil for the manufacture of flexible printed wiring boards, etc., and the blackened surface-treated copper foil is a surface-treated copper foil having a roughened surface, and is characterized in that the roughened surface The surface is a black roughened surface having a maximum level difference (Wmax) of 1.2 μm or less, and a color tone having a lightness L* of L*a*b* colorimetric system of 30 or less.

Description

technical field [0001] The application relates to a blackened surface-treated copper foil, a manufacturing method of the blackened surface-treated copper foil, a copper-clad laminate obtained by using the blackened surface-treated copper foil, and a flexible printed circuit board. In particular, this application relates to the surface-treated copper foil which performed the fine roughening process which blackened the copper foil surface. Background technique [0002] Conventionally, AOI (Automatic Optical Inspecter) has been widely used for automatic inspection as an automatic appearance inspection device for printed wiring boards. AOI is to project light from the back of the printed circuit board, capture the light passing through the printed circuit board and read the circuit pattern, so as to find out the line defect, line thinning, pinhole, scratch, short circuit, line change that deviates from the specification. Devices with circuit defects such as roughness, copper re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/06C25D3/38H05K1/09
CPCC25D3/38H05K1/09C25D5/028C25D7/0614C25D7/0692H05K3/384H05K2201/0154H05K2201/0355C25D5/627C25D5/605
Inventor 沟口美智小畠真一立冈步平冈慎哉桥口隆司
Owner MITSUI MINING & SMELTING CO LTD
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