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A method for controlling the pore size of open-cell foamed copper

A technology of open-cell foam and copper foam, which is applied in the direction of cells, electrolysis, electroforming, etc., can solve the problems of large pore size, complex process, and difficult regulation of foam copper, and achieve low cost, simple process conditions, and increased skeleton size. Effect

Active Publication Date: 2017-07-07
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is complicated in process and high in cost, and the pore size of the prepared copper foam is relatively large (generally greater than 450 μm), and it is not easy to control, so its application in the field with strict requirements on pore size is limited.

Method used

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  • A method for controlling the pore size of open-cell foamed copper
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  • A method for controlling the pore size of open-cell foamed copper

Examples

Experimental program
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Effect test

Embodiment 1

[0031] A copper foam with a thickness of 1.5 mm and a pore size of 450 μm was selected as the cathode, and cleaned with acetone and ethanol in an ultrasonic environment of 100 W power for 10 min, blown dry with nitrogen, and immersed in 1 mol / L hydrochloric acid aqueous solution for 3 min to remove the oxide film on the surface. And activate the surface of foamed copper tendons, take it out, wash it with dilute alkali solution and deionized water respectively, and dry it with nitrogen gas. The treated and activated foamed copper is used as the cathode, and two pure copper sheets of the same size are used as the anode, and a 200g L -1 CuSO 4` 5H 2 O and 60ml·L -1 H 2 SO 4 In the solution, the concentration of sodium dodecylbenzenesulfonate in the solution is 1g / L, the distance between the poles is 5cm, and the current density is 0.02A / cm 2 , 0.04A / cm 2 , 0.06A / cm 2 、0.08A / cm 2 , electroplating at room temperature for 5h, with 500r / m electromagnetic stirring during elect...

Embodiment 2

[0034] A copper foam with a thickness of 3mm and a pore size of 450μm was selected as the cathode, and the current density was 0.02A / cm 2 Next, plating for different times. The pretreatment process is the same as Example 1, inserting 200g L -1 CuSO 4` 5H 2 O and 60ml·L -1 H 2 SO 4 In the solution, the concentration of sodium dodecylbenzenesulfonate in the solution is 5g / L, the distance between the two poles is 8cm, and the current density is 0.02A / cm 2 , electroplating at room temperature for 3h, 6h, 9h, 12h, with 800r / m electromagnetic stirring during electroplating. After taking it out, rinse it with clean water and place it in an oven at 50-60°C for 0.5-1.5 hours.

[0035] Under this current density, the microscopic morphology of copper foam electroplated for different times of 3h and 12h is as follows: Figure 5 with Image 6 shown. When electroplating for 3 hours, the plating layer is formed by the arrangement of regular-shaped individual copper particles. With ...

Embodiment 3

[0037] A copper foam with a thickness of 5mm and a pore size of 450μm was selected as the cathode, and the current density was 0.06A / cm 2 Next, plating for different times. The pretreatment process is the same as Example 1, inserting 200g L -1 CuSO 4` 5H 2 O and 60ml·L -1 H 2 SO 4 In the solution, the concentration of sodium dodecylbenzenesulfonate in the solution is 10g / L, the distance between the two poles is 10cm, and the current density is 0.06A / cm 2 , electroplating at room temperature for 3h, 6h, 9h, 12h, with 1000r / m electromagnetic stirring during electroplating. After taking it out, rinse it with clean water and place it in an oven at 50-60°C for 0.5-1.5 hours.

[0038] Under high current density, the microscopic morphology of copper foam electroplated for different time 3h and 12h is as follows Figure 8 with Figure 9 shown. Under the condition of constant plating time, high current density has a greater effect on reducing the aperture than low current den...

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Abstract

The invention relates to a method for regulating the pore size of open-cell foamed copper. The specific steps are as follows: using the double anode plating method, first, after degreasing and deoxidizing the copper foam to be treated, it is used as the cathode, and two pure copper sheets of the same size are used as the anode, which are inserted into the mixed aqueous solution of CuSO4 and H2SO4 for electroplating at room temperature , the reaction time is 3-12h, and the current density is 0.02-0.08A / cm2; the electroplated copper foam is washed with deionized water and dried to obtain foam copper with corresponding pore size. The method has the advantages of simple equipment and process, easy operation, low cost and suitability for industrial production. The foamed copper coating prepared by the invention has the characteristics of high density, good uniformity, stable performance, firm bonding with the substrate, etc., and has great application prospects in the separation of oil-water mixtures with different oil droplet particle sizes.

Description

technical field [0001] The invention relates to an open-cell foam copper aperture control technology. Background technique [0002] Porous material is a material with a network structure composed of interpenetrating or closed pores. According to different aggregation forms, porous materials are divided into two types: one is a two-dimensional structure formed by the aggregation of a large number of polygonal pores on a plane; more generally, a three-dimensional structure is formed by the aggregation of a large number of polyhedral pores in space, usually called For "foam" material. Copper foam is a three-dimensional porous new multifunctional material with a large number of connected or closed pores evenly distributed inside the copper matrix. It has low density, high porosity, high specific surface area and good damping and shock absorption, electromagnetic shielding, breathable and water-permeable, etc. Therefore, copper foam is widely used in aerospace, petrochemical, e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D1/08C25D5/34C25D21/10
Inventor 张友法高琳余新泉
Owner SOUTHEAST UNIV
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