Metallographic phase corrosive agent suitable for silver-palladium copper alloy, and preparation method and use method thereof
A technology of silver-palladium-copper and etchant, which is applied in the field of silver-palladium alloys, can solve problems such as unfound formulas, and achieve the effects of wide application, good application prospects, and simple operation
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Embodiment 1
[0018] The preparation of embodiment 1 metallographic etchant
[0019] A kind of silver-palladium-copper alloy metallographic etchant, first 10ml hydrofluoric acid (mass percentage concentration 10%) is placed in plastic container, then add 80ml sulfuric acid (mass percentage concentration 95%~98%), seal preservation, at room temperature Cool and stand for two hours, finally add 10ml of nitric acid (mass percentage concentration 95%-98%), and mix well.
Embodiment 2
[0020] The preparation of embodiment 2 metallographic etchant
[0021] A kind of silver-palladium-copper alloy metallographic etchant, first 10ml hydrofluoric acid (mass percentage concentration 40%) is placed in plastic container, then add 90ml sulfuric acid (mass percentage concentration 95%~98%), seal preservation, at room temperature Cool and stand for two hours, finally add 10ml of nitric acid (mass percentage concentration 95%-98%), and mix well.
Embodiment 3
[0022] The preparation of embodiment 3 metallographic etchant
[0023] A kind of silver-palladium-copper alloy metallographic etchant, first 10ml hydrofluoric acid (mass percentage concentration 40%) is placed in plastic container, then add 80ml sulfuric acid (mass percentage concentration 95%~98%), seal preservation, at room temperature Cool and stand for two hours, finally add 15ml of nitric acid (mass percentage concentration 95%-98%), and mix well.
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