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Preparing method for polyamide hot melt adhesive

A technology of polyamide hot-melt adhesive and caprolactam, which is applied in the direction of adhesives, etc., can solve the problems that hot-melt adhesives cannot meet the requirements, and achieve the effects of narrow melting range, high melting point and cost reduction

Active Publication Date: 2015-10-07
SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In these cases, the above hot melt adhesives will not suffice

Method used

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  • Preparing method for polyamide hot melt adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] 237.3 g of caprolactam, 131.4 g of adipic acid, 109.04 g of hexamethylenediamine, 80.8 g of sebacic acid, 40.8 g of 1,5-pentamethylenediamine, 14.79 g of stearic acid, and 200 ml of water were added to a 2 L digitally controlled autoclave. Heat until the temperature in the kettle is 230~245℃, and start the polycondensation reaction. At this time, keep the pressure in the kettle at 1.6~1.8Mpa and react for 1.5h; Slowly reduced to normal pressure; in N 2 Reaction under normal pressure for 1.0 h under protection; after the reaction under normal pressure, pass nitrogen gas until the pressure in the kettle is 0.15~0.2Mpa, discharge while hot, and obtain the target product P1.

Embodiment 2

[0023] 226g of caprolactam, 160.6g of adipic acid, 132.24g of hexamethylenediamine, 40.4g of sebacic acid, 20.4g of 1,5-pentamethylenediamine, 7.38g of benzoic acid and 150ml of water were added to a 2L digitally controlled autoclave. Heat until the temperature in the kettle is 245~260℃, and start the polycondensation reaction. At this time, keep the pressure in the kettle at 1.5~1.6Mpa and react for 1.5h; Slowly reduced to normal pressure; in N 2 The reaction was carried out under normal pressure for 1.5 h under protection; after the normal pressure reaction was completed, nitrogen gas was passed until the pressure inside the kettle was 0.15-0.2 Mpa, and the material was discharged while it was hot to obtain the target product P2.

Embodiment 3

[0025] 237.3 g of caprolactam, 146 g of adipic acid, 110.2 g of hexamethylenediamine, 60.6 g of sebacic acid, 40.8 g of 1,5-pentamethylenediamine, 4.21 g of acetic acid, and 150 ml of water were added to a 2L digitally controlled autoclave. Heat until the temperature in the kettle is 245~260℃, and start the polycondensation reaction. At this time, keep the pressure in the kettle at 1.5~1.7Mpa and react for 1.2h; Slowly reduced to normal pressure; in N 2 The reaction was carried out under normal pressure for 1.5 hours under protection; after the reaction under normal pressure, nitrogen gas was passed until the pressure in the kettle was 0.15~0.2Mpa, and the material was discharged while it was hot to obtain the target product P3.

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Abstract

The invention relates to a preparing method for polyamide hot melt adhesive, in particular to a preparing method for polyamide hot melt adhesive resistant to high temperature, high in melting point and narrow in melting range. According to the technical scheme, the preparing method is characterized in that two kinds of binary acid, the proportion and design of two kinds of diamine, caprolactam and monobasic acid are carefully selected, and the polyamide hot melt adhesive resistant to high temperature, high in melting point and narrow in melting range is obtained by a common method. The performance requirements of special field application are met, and the cost can be effectively lowered. The polyamide hot melt adhesive prepared through the preparing method can meet the requirement for adhering to automobile components and electronic components of which the working condition temperature reaches 140 DEG C.

Description

technical field [0001] The invention relates to a preparation method of polyamide hot-melt adhesive, in particular to a preparation method of polyamide hot-melt adhesive with high temperature resistance, high melting point and narrow melting range. Background technique [0002] Polyamide hot-melt adhesive is a kind of hot-melt adhesive prepared by melt polycondensation of aliphatic dibasic acid and aliphatic dibasic amine. Because this kind of hot melt adhesive contains polar groups such as amide group, amino group and carboxyl group, it has good adhesion to many polar materials, so polyamide sol is widely used in chemical industry, automobile, light chemical industry, textile industry, etc. and other fields. [0003] Chinese patent CN101307218 discloses a high-temperature-resistant water-washable polyamide hot-melt adhesive for clothing and a preparation method thereof, wherein an aliphatic dicarboxylic acid with 5 to 12 carbon atoms and an aliphatic monocarboxylic acid wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/00C08G69/36
Inventor 薛为岚周磊李哲龙朱万育曾作祥
Owner SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD
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