Integrated heat-pipe heat dissipating device

A technology of heat dissipation device and heat pipe, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of limited heat dissipation effect and the inability of heat dissipation device to meet the requirements, and achieve the effect of excellent heat dissipation effect

Inactive Publication Date: 2015-08-26
DONGGUAN SHUHUA METAL PROD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the gradual miniaturization of electronic products, the size of the cooling device is required to be smaller and smaller, and the traditional cooling device can no longer meet the requirements.
[0003] In the prior art, for the heat dissipation problem of electronic products such as CPU, LED, etc., heat dissipation is also carried out through heat sinks, but this method still has the defect of limited heat dissipation effect

Method used

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  • Integrated heat-pipe heat dissipating device
  • Integrated heat-pipe heat dissipating device
  • Integrated heat-pipe heat dissipating device

Examples

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Embodiment 1

[0047] An integrated heat pipe cooling device, such as Figure 1 to Figure 5 As shown, a plurality of heat dissipation pipes 200, a heat conduction base 100 and a plurality of heat dissipation fins 300 are provided, and the plurality of heat dissipation fins 300 are respectively fixedly mounted on one side of the heat conduction base 100 and the heat dissipation fins 300 are in contact with the heat conduction base 100 to dissipate heat. The fins 300 are perpendicular to the heat conduction base 100 , the heat receiving sections of the plurality of heat dissipation pipes 200 are attached to the other side of the heat conduction base 100 without gaps, and the heat dissipation sections of the heat dissipation conduits 200 are assembled on the plurality of heat dissipation fins 300 .

[0048] During use, the heat source such as a chip is directly assembled on the heat dissipation section of the heat dissipation pipe 200 installed on the heat conduction base 100 . The heat generat...

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PUM

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Abstract

An integrated heat-pipe heat dissipating device comprises a plurality of the heat dissipating pipes, a heat conducting seat and a plurality of heat dissipating fins, wherein the heat dissipating fins are fixedly assembled on one surface of the heat conducting seat separately, and propped against and perpendicularly connected to the heat conducting seat; the heated sections of the heat dissipating pipes are matched with the other surface of the heat conducting seat in a gapless manner; the heat dissipating sections of the heat dissipating pipes are assembled in the heat dissipating fins; two sub pipes adopting the same structure are separately arranged on each heat dissipating pipe; a plurality of circular through holes are formed in the heat dissipating fins, and a plurality of scrape-proof baffles are arranged on the heat dissipating fins. The integrated heat-pipe heat dissipating device has the characteristics of being good in heat dissipating effect.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic products, in particular to an integrated heat pipe heat dissipation device. Background technique [0002] Good heat dissipation performance is an important guarantee to ensure the effective operation of electronic products. Electronic products usually use heat sinks made of aluminum or copper for heat dissipation, and some larger products are also cooled by liquids such as water or other cooling fluids. However, with the gradual miniaturization of electronic products, the volume of the cooling device is required to be smaller and smaller, and the traditional cooling device can no longer meet the requirements. [0003] In the prior art, for the heat dissipation problem of electronic products such as CPU, LED, etc., heat dissipation is also carried out through heat sinks, but this method still has the defect of limited heat dissipation effect. [0004] Therefore, in view of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 刘毓福金龙华
Owner DONGGUAN SHUHUA METAL PROD CO LTD
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