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Method for preparing sandwich structure diamond-Al composite material

A composite material and diamond technology, applied in the field of preparation of sandwich structure diamond-Al composite materials, can solve problems such as difficulty in controlling the thickness of the copper layer, and achieve the effects of machinability, low thermal resistance, and high interface bonding strength

Active Publication Date: 2015-08-26
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, from the analysis of its processing principle, this method is difficult to control the thickness of the copper layer on the upper and lower surfaces (the copper layer is required to be very thin and uniform)

Method used

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  • Method for preparing sandwich structure diamond-Al composite material
  • Method for preparing sandwich structure diamond-Al composite material
  • Method for preparing sandwich structure diamond-Al composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Put Ti-coated diamond particles (particle size: 104-124 μm) with a volume fraction of 45% and aluminum powder (nitrogen atomization, particle size: 20-30 μm) with a volume fraction of 55% on a three-dimensional planetary mixer for 6 hours . The diamond-Al composite powder was cold-pressed under a hydraulic press with a pressing pressure of 200 MPa to obtain a diamond-Al powder compact with a diameter of 20 mm. Aluminum foils with a diameter of 20 mm and a thickness of 400 μm were cut, respectively placed on the upper and lower surfaces of the compact, and molded. Sinter the compact in a vacuum hot-press furnace at a temperature of 650°C, a sintering pressure of 50 MPa, and a vacuum degree of 10 -3 Pa, holding time 90min, obtain sandwich structure diamond-Al composite material (such as Figure 4Shown), the measured thermal conductivity is 467W / m·K. The surface of the sandwich structure is polished with 800 and 1200 mesh sandpaper, and the thickness of the residual alu...

Embodiment 2

[0036] Put Ti-coated diamond particles (particle size: 89-104 μm) with a volume fraction of 50% and aluminum powder (nitrogen atomization, particle size: 20-30 μm) with a volume fraction of 50% on a three-dimensional planetary mixer for 6 hours . The diamond-Al composite powder was cold-pressed under a hydraulic press with a pressing pressure of 200 MPa to obtain a diamond-Al powder compact with a diameter of 20 mm. Aluminum foils with a diameter of 20 mm and a thickness of 150 μm were cut, respectively placed on the upper and lower surfaces of the compact, and molded. Sinter the compact in a vacuum hot-press furnace at a temperature of 640°C, a sintering pressure of 70MPa, and a vacuum degree of 10 -3 Pa, the holding time is 60min, and the sandwich structure diamond-Al composite material is obtained after cooling, and the measured thermal conductivity is 424W / m·K. The surface of the sandwich structure is polished with 800 and 1200 mesh sandpaper, and the thickness of the re...

Embodiment 3

[0038] Put Ti-coated diamond particles (particle size: 150-178 μm) with a volume fraction of 55% and aluminum powder (nitrogen atomization, particle size: 20-30 μm) with a volume fraction of 45% on a three-dimensional planetary mixer for 6 hours . The diamond-Al composite powder was cold-pressed under a hydraulic press with a pressing pressure of 200 MPa to obtain a diamond-Al powder compact with a diameter of 20 mm. Aluminum foils with a diameter of 20 mm and a thickness of 200 μm were cut, respectively placed on the upper and lower surfaces of the compact, and molded. Sinter the above compact in a vacuum hot press furnace at a temperature of 650°C, a sintering pressure of 30MPa, and a vacuum degree of 10 -3 Pa, the holding time is 120min, and the sandwich structure diamond-Al composite material is obtained after cooling, and the measured thermal conductivity is 448W / m·K. The surface of the sandwich structure is polished with 800 and 1200 mesh sandpaper, and the thickness o...

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Abstract

The invention relates to a method for preparing a sandwich structure diamond-Al composite material. The method comprises the specific steps that ti-coated diamond particles and aluminium powder are mixed according to a certain proportion, then the mixed powder is subjected to cold-pressed forming, and a diamond-Al green compact is obtained; the upper surface and the lower surface of the diamond-Al green compact are coated with aluminum foil, and then the green compact is subjected to vacuum hot-pressing sintering, so that the sandwich structure diamond-Al composite material is obtained; an aluminium layer on the surface of the sandwich structure diamond-Al composite material is subjected to grinding and mechanical polishing or electrochemical polishing, so that the flat and smooth surface is obtained. The grain diameter of adopted diamonds is 89-200 [mu]m, and the volume fraction of the adopted diamonds is 40-55%. The grain diameter of the aluminium powder is 20-30 [mu]m, and the volume fraction of the aluminium powder is 45-60%. The thickness of the aluminium foil is 100-300 [mu]m. The method for preparing the sandwich structure diamond-Al composite material has the advantages that the diamond-Al composite material which is high in compactness, ultrahigh in thermal conductivity, capable of achieving surface processing can be prepared, and the surface evenness and the roughness can meet the demand of a radiating fin for electronic packaging; the surface aluminium layer completely covers the diamond particles.

Description

technical field [0001] The invention relates to an ultra-high thermal conductivity metal matrix composite material, in particular to a method for preparing a sandwich-structured diamond-Al composite material with ultra-high thermal conductivity and a processable surface for electronic packaging. Background technique [0002] With the continuous development of electronic technology, electronic devices and components in electronic equipment are becoming more and more complex and integrated, which will inevitably lead to an increase in the heat generated by the device. has received extensive attention. Diamond is the substance with the highest thermal conductivity in nature (up to 2000W / m K), its thermal conductivity is 4-5 times that of copper, 8-10 times that of aluminum, and its expansion coefficient is very low, so diamond particles and metal ( Al, Cu, Ag, etc.) are compounded into composite materials, which can make them have the characteristics of ultra-high thermal cond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F7/04H01L23/373
Inventor 陈锋陈培架余新泉张友法曾从远
Owner SOUTHEAST UNIV
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