Chip cooling system

Abstract

The invention relates to a chip cooling system, which comprises a chip heat conduction plate used for primary heat exchange, and an annular heat pipe used for secondary heat exchange, wherein a plurality of micro-channels are arranged on the chip heat conduction plate side by side, the micro-channels are connected with a circulating pipeline provided with a pump simultaneously to form a circulating loop, and the circulating loop is filled with liquid I; and the annular heat pipe is sleeved in the circulating loop to form a sleeving structure, the annular heat pipe is filled with liquid II and gas, and the pressure intensity of the gas is always less than the atmospheric pressure intensity. The chip cooling system combines the micro-channels with the annular heat pipe to form a two-stage heat exchange system, the micro-channels can provide large radiating heat flux and can absorb heat on the chip timely, the annular heat pipe fully utilizes effects such as phase change and gravity as a driving force, the radiating efficiency is high, and the cost is low; and the heat passes through the circulating loop and the annular heat pipe from the chip and is radiated to the environment, the radiating power is high, and the effect is good.

Description

technical field [0001] The invention belongs to the field of chip cooling, and in particular relates to a chip cooling system. Background technique [0002] With the continuous improvement of electronic computer manufacturing technology and process level, computer microprocessor CPU is developing towards high integration, miniaturization and high frequency, which leads to the increase of CPU heat dissipation, and the problem of cooling and heat dissipation is becoming more and more acute. unsolvable. The heat dissipation problem is related to the stability of the computer. If it is not solved properly, it will lead to a serious decline in computer performance and affect the reliability of the product. Seriously, it will also affect the use and life of other components of the computer, and many unexplained crashes are often caused by heat dissipation. caused by the problem. [0003] The traditional air cooling has poor heat dissipation efficiency, high noise, and is limited...

AI Technical Summary

Problems solved by technology

The heat dissipation problem is related to the stability of the computer. If it is not solved properly, it will lead to a serious decline in computer performance and affect the reliability of the product. Seriously, it will also affect the use and life of other components of the computer, and many unexplained crashes are often caused by heat dissipation. caused by the problem

[0003] The traditional air cooling has poor heat dissipation efficiency, high noise, and is limited by space; heat pipe cooling has limited heat dissipation capacity; although the water cooling system has strong heat dissipation capacity and is very quiet, it needs a water pump to provide power, which is costly, and water leakage will destroy the chip

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