Power supply printed circuit board and processing method thereof

Abstract

The invention is applied to the technical field of a printed circuit board, and provides a processing method of a power supply printed circuit board and a power supply printed circuit board formed by use of the processing method, for the purpose of solving the problems of poor voltage-withstanding capability of a conventional power supply printed circuit board and inconvenient assembling due to large board thickness in the prior art. The processing method of the power supply printed circuit board comprises the following steps: manufacturing an internal layer core plate, providing a soft plate copper-clad plate as the inside core plate, wherein the soft plate copper-clad plate comprises a polyimide substrate and copper coil layers arranged at the two opposite surfaces of the polyimide substrate; performing plasma coarsening processing on the surfaces of the copper foil layers; performing lamination and pressing to form a multilayer circuit board; performing boring processing on the multilayer circuit board and forming a conducting hole; performing plasma glue removing; and performing metallization processing on the conducting hole and forming an external line graph on an external copper layer. According to the processing method, the soft plate copper-clad plate is taken as the internal layer core plate, the voltage withstanding capability of the soft plate copper-clad plate is improved, and the thickness of the power supply printed circuit board is effectively reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a processing method of a power supply printed circuit board and a power supply printed circuit board formed by the processing method. Background technique [0002] In the printed circuit board industry, power printed circuit boards are one of the main products processed in the printed circuit board industry, and the application range of multilayer power printed circuit boards is becoming wider and wider. [0003] Power printed circuit boards often pass through large currents. In order to ensure functionality, the inner copper thickness of the product must be thicker to reduce the resistance caused by excessive current and prevent problems such as burning boards; at the same time, the use conditions of power printed circuit boards Strict, it is required to withstand high voltage (above 5000V) and prevent high voltage breakdown to prevent safety accidents...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a processing method of a power printed circuit board, using a soft board copper clad laminate as the inner core board of a power printed circuit board, the soft board copper clad board includes a polyimide base material and is arranged on a polyimide The copper foil layer on the two opposite surfaces of the imide substrate aims to solve the problem of poor voltage withstand capability and large thickness of the power printed circuit board in the prior art, which is not easy to assemble

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