A kind of matte type epoxy resin encapsulation adhesive for outdoor LED encapsulation and preparation method thereof

A technology of LED encapsulation and epoxy resin, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of high brightness of LED light, poor heat-resistant yellowing performance, high stress of epoxy compound, etc. The effect of strong operability, stable performance and high reliability

Active Publication Date: 2017-03-08
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Generally speaking, the existing epoxy resin packaging adhesives for LED packaging still have the following disadvantages: (1) Although the light transmission is good, the LED light output brightness is too high when used for outdoor LED packaging, which is likely to cause glare or light pollution; (2) Poor thermal yellowing resistance and unsatisfactory UV aging resistance; (3) After curing, the epoxy compound has a large stress and is easy to crack, and it is difficult to pass the high reliability test
Although some epoxy resin encapsulation adhesives can achieve a matte effect, making the light emitting effect softer, but the viscosity is too high, which reduces the operability of customers, and the prepared glue is easy to layer, and it is cloudy after curing.

Method used

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  • A kind of matte type epoxy resin encapsulation adhesive for outdoor LED encapsulation and preparation method thereof
  • A kind of matte type epoxy resin encapsulation adhesive for outdoor LED encapsulation and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] First, prepare the matte powder according to the following steps: (1') First, combine the fumed silica powder (the average particle size of fumed silica powder is 5μm) with spherical methyl solid silicone resin powder (spherical methyl solid The average particle size of the silicone resin powder is 9μm.) Mix uniformly according to the weight ratio of 3:2 to obtain a mixed powder; (2') Dissolve γ-glycidoxypropyltrimethoxysilane in ethanol to prepare a weight percentage concentration Is a 10% solution, then add acetic acid to the solution and adjust the pH to 4.5 (acetic acid can play a catalytic role); (3') add the mixed powder obtained in step (1') to the solution obtained in step (2') And carry out high-speed dispersion to obtain a mixture material; (4') the mixture material obtained in step (3') is filtered to remove the filtrate, and the solid matter obtained by the filtration is dried to obtain a matte powder.

[0026] In the above step (3'), the weight ratio of the mi...

Embodiment 2

[0033] First, prepare the matte powder according to the following steps: (1') First, combine the fumed silica powder (the average particle size of fumed silica powder is 8μm) with spherical methyl solid silicone resin powder (spherical methyl solid The average particle size of the silicone resin powder is 10μm.) Mix uniformly according to the weight ratio of 1:0.5 to obtain a mixed powder; (2') Dissolve γ-glycidoxypropyltrimethoxysilane in ethanol to prepare a weight percentage concentration Is an 8% solution, then add oxalic acid to the solution and adjust the PH value to 4 (oxalic acid can play a catalytic role); (3') add the mixed powder obtained in step (1') to step (2') (4') The mixture obtained in step (3') is filtered to remove the filtrate, and the solid matter obtained by the filtration is dried to obtain a matte powder.

[0034] In the above step (3'), the weight ratio of the mixed powder obtained in step (1') to the solution obtained in step (2') is 2:1.

[0035] Then, ...

Embodiment 3

[0041] First, prepare the matte powder according to the following steps: (1') First, combine the fumed silica powder (the average particle size of fumed silica powder is 5μm) with spherical methyl solid silicone resin powder (spherical methyl solid The average particle size of the silicone resin powder is 7μm.) Mix uniformly according to the weight ratio of 1:2 to obtain a mixed powder; (2') Dissolve γ-glycidoxypropyltrimethoxysilane in ethanol to prepare a weight percentage concentration Is a 14% solution, then add acetic acid to the solution and adjust the pH to 5 (acetic acid can play a catalytic role); (3') add the mixed powder obtained in step (1') to the solution obtained in step (2') And carry out high-speed dispersion to obtain a mixture material; (4') the mixture material obtained in step (3') is filtered to remove the filtrate, and the solid matter obtained by the filtration is dried to obtain a matte powder.

[0042] In the above step (3'), the weight ratio of the mixe...

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Abstract

An outdoor LED packing matt epoxy resin package adhesive comprises a component A and a component B; the component A comprises the following ingredients in parts by weight: 100 parts of cycloaliphatic epoxy resin, 0.05-2 parts of an antioxidant, 0.1-5 parts of an accelerant A, 5-25 parts of matt powder, and 0.1-1 part of a defoamer; the component B comprises the following ingredients in parts by weight: 60-150 parts of acid anhydride, 0.05-2 parts of an antioxidant, 0.1-5 parts of an accelerant B and 0.1-1 part of a defoamer; the mole ratio of an epoxy group in the component A to acid anhydride in the component B is 1:1; the acceleration effects of the accelerant A and the accelerant B are different. The invention also provides a preparation method of the epoxy resin package adhesive. The epoxy resin package adhesive has the advantages of being low in viscosity, strong in operability, and high in reliability, and resisting high temperature and high humidity; the surface of a cured material has a matt effect; the packed LED brightness is high and soft, and the heat yellowness resistance and the UV yellowness resistance are superior.

Description

Technical field [0001] The invention relates to a packaging material applied to LEDs, in particular to a matte epoxy resin packaging glue for outdoor LED packaging and a preparation method thereof. Background technique [0002] LED lighting devices are lighting appliances that use LEDs (light emitting diodes) as the light source. As a new type of green lighting source product, it is widely used in outdoor areas such as outdoor advertising displays, landscape lighting, and special lighting. [0003] Generally speaking, the existing epoxy resin encapsulant used for LED packaging still has the following shortcomings: (1) Although the light transmittance is good, the brightness of the LED light is too high when used for outdoor LED packaging, which is likely to cause dazzling or light pollution; (2) The heat yellowing performance is poor, and the UV aging resistance is not ideal; (3) The epoxy compound has high stress after curing, easy to crack, and it is difficult to pass the high re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/06C09J11/04C08G59/42
Inventor 周振基周博轩石逸武许喜銮冯兆丰
Owner NICHE TECH KAISER SHANTOU
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