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Novel full-automatic vertical and continuous electroplating device for PCB

A vertical continuous electroplating and fully automatic technology, applied in the direction of electrolysis process, electrolysis components, etc., can solve the problems of serious environmental pollution, complex operation, large amount of waste water, etc., achieve uniform coating, uniform redistribution, and reduce production and operation costs Effect

Active Publication Date: 2015-07-22
栾善东
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The nitric acid system is often used in the deplating process, which is not only dangerous, but also complicated to operate, causing serious environmental pollution and a large amount of waste water

Method used

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  • Novel full-automatic vertical and continuous electroplating device for PCB
  • Novel full-automatic vertical and continuous electroplating device for PCB
  • Novel full-automatic vertical and continuous electroplating device for PCB

Examples

Experimental program
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Embodiment Construction

[0055] The following combination Attached picture The present invention is described:

[0056] Such as figure 1 As shown in -9, in the middle part of each electroplating copper cylinder, use the tank walls on both sides as the back baffle of the middle anode chamber 1, and weld 4 side risers 103 at equal intervals on the tank walls, and the two sides of the middle chamber are on the side Leave a certain distance on the vertical plate 103 from the tank wall to weld the back baffle 104, leave a certain distance to weld the bottom plate 105 from the bottom of the tank, and the space left is used as the overflow channel 4, and the tank wall is provided with an overflow port. There are slots on both sides of the vertical plate 103 for the insertion of the diaphragm inserting plate 102. After insertion, fluorine rubber sealing strips are used to squeeze in and seal, forming several independent In the anode chamber 1, a hole is opened on the inner vertical plate 103 of each an...

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PUM

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Abstract

The invention discloses a novel full-automatic vertical and continuous electroplating device for a PCB. The novel full-automatic vertical and continuous electroplating device comprises the following steps: automatic loading, chain transmission, pre-treatment, electroplating, post-treatment and automatic unloading. An independent anode chamber structure, lower auxiliary chain clamping, side spraying, adjustable height bottom spray, a guide member, an independent slide block connecting clamp as a guide and conducting structure, and a rubber sealing conductive chuck without deplating are adopted by an electroplating copper cylinder; and push spring-loaded tension adjustment is adopted by chain transmission. The novel full-automatic vertical and continuous electroplating device has the beneficial effects that anode liquid is completely separated from cathode electroplate liquid by the independent anode chamber; anode mud is thoroughly prevented from entering the cathode electroplate liquid to avoid affecting the electroplating quality; the filtering burden is removed or significantly reduced; the consumption of an additive is greatly reduced; the process is simplified by the chuck without deplating; dual-row operation can be realized; and the capacity is improved.

Description

technical field [0001] The invention belongs to the technical field of electroplating, in particular to a full-automatic PCB vertical continuous electroplating (VCP) production line. Background technique [0002] In the PCB process, copper plating is usually performed on the entire board for through holes, blind holes and filled holes for the needs of line connections. Vertical continuous electroplating (VCP) is a relatively advanced continuous electroplating method newly developed in the industry in recent years. More and more people in the industry have abandoned rack plating and adopted VCP. It uses continuous processing, automatic loading and unloading and other means to overcome hanging Insufficient plating, good plating uniformity and high efficiency and automation. However, the vertical continuous electroplating line of the prior art still has a large amount of solution circulation, a heavy burden of filtration, a large consumption of additives, the conductive chuck ...

Claims

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Application Information

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IPC IPC(8): C25D19/00C25D7/00C25D17/00C25D17/06
Inventor 栾善东栾光邈
Owner 栾善东
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