Nickel-chromium plated parts and method of manufacture
A manufacturing method and component technology, applied in the field of nickel-chromium plated components and their manufacturing, can solve the problems of inability to achieve corrosion resistance, trivalent chromium electroplating, and easy brittleness of the coating.
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Embodiment 1
[0090] The nickel-chrome plated part of the present embodiment, this part comprises: base material 1 (ABS material); On the substrate 1, a bottoming nickel layer 808 is deposited on the chemical nickel layer 809, and a copper plating layer 3 is formed on the bottoming nickel layer 808; and a base layer 6, which is formed on the copper plating layer 3; and a functional layer 4 , which is formed on the base layer 6, wherein the functional layer 4 includes a low-potential nickel layer 141 and a microporous nickel layer 142, wherein the low-potential nickel layer 141 is a high-sulfur nickel layer, and the microporous nickel layer 142 is formed on the low-potential nickel layer 141 and a decoration layer 802, which is formed on the microporous nickel layer 142, wherein the decoration layer is a trivalent white chromium layer.
Embodiment 2
[0092] The nickel-plated part of the present embodiment, this part comprises: base material 1 (ABS material); Pretreatment plating layer 2 comprises chemical nickel layer 809, makes a bottom nickel layer 808 and copper plating layer 3, and chemical nickel layer 809 is deposited on the whole base material 1, a bottoming nickel layer 808 is deposited on the chemical nickel layer 809, and a copper plating layer 3 is formed on the bottoming nickel layer 808; and a base layer 6, which is formed on the copper plating layer 3; and a functional layer 4, which Formed on the base layer 6, wherein the functional layer 4 includes a low-potential nickel layer 141 and a microporous nickel layer 142, wherein the low-potential nickel layer 141 is a micro-cracked nickel layer, and the microporous nickel layer 142 is formed on the low-potential nickel layer 141; And a decoration layer 802, which is formed on the microporous nickel layer 142, wherein the decoration layer is a trivalent white chro...
Embodiment 3
[0094] The nickel-plated part of the present embodiment, this part comprises: base material 1 (ABS material); Base layer 2 comprises chemical nickel layer 809, make a nickel layer 808 and copper-plated layer 3, and chemical nickel layer 809 is deposited on whole base material 1 On, the base layer 808 of nickel is deposited on the chemical nickel layer 809, and the copper layer 3 is formed on the base layer 808; and the base layer 6 is formed on the copper layer 3; and the functional layer 4 is formed On the base layer 6, wherein the functional layer 4 includes a low-potential nickel layer 141 and a microporous nickel layer 142, wherein the low-potential nickel layer 141 is a high-sulfur nickel layer and a micro-crack nickel layer (which may be formed on a copper-plated layer of high-sulfur nickel On the layer 3, the microcrack nickel layer is formed on the high-sulfur nickel layer; it can also be that the microcrack nickel layer is formed on the copper plating layer 3, and the ...
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