Server cooling system combining natural cooling water cooling device and liquid cooling device

Abstract

The invention discloses a natural cooling cold water device and liquid cooling device combined server cooling system which comprises a liquid cooling server cabinet. The liquid cooling server cabinet comprises a cabinet body and multiple liquid cooling servers arranged in the cabinet body, is provided with liquid cooling devices for direct liquid cooling and heat dissipation of the liquid cooling servers and is further provided with a natural cooling cold water device for auxiliary heat dissipation. The natural cooling cold water device and liquid cooling device combined server cooling system is capable of performing high-density refrigeration, high in heat exchange efficiency, low in energy consumption, capable of solving local hot points, small in occupied area, high in reliability, small in noise and long in service life.

Description

technical field [0001] The invention relates to a heat dissipation system for a server cabinet, in particular to a server heat dissipation system combining a natural cooling water cooling device and a liquid cooling device. Background technique [0002] With the continuous increase of high-density cabinets in the IDC Internet data center computer room, the integration of equipment is getting higher and higher, and the processing capacity is gradually increasing, but the power consumption of the equipment is also increasing, resulting in more heat generated by the equipment in the cabinet. According to statistics, at present, the cabinet servers in large-scale IDC computer rooms in China generate a lot of heat, and basically run 8760h throughout the year. It accounts for about 40% to 50% of the overall energy consumption of the data center. [0003] Traditional data room air supply methods include floor air duct air supply, hot and cold aisle isolation air supply, and whole ...

AI Technical Summary

Problems solved by technology

This patent uses the second circulation loop to take away the heat of the first circulation loop, but the radiator of the first circulation loop conducts heat to the air inside the entire server cabinet, and does not directly conduct heat to the server heating element chip, which leads to heat dissipation in the patent. The efficiency is low and the effect is poor. In addition, the first circulation loop is equipped with the first water pump. The first water pump generates more heat when it is running. It is necessary to set up a special heat exchanger to transfer the heat accumulated by the first water pump. This will undoubtedly burden the system. Thereby further reducing the heat dissipation efficiency of the system

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