Novel silicon wafer wax-polishing method

Abstract

The invention provides a novel silicon wafer wax-polishing method which is improved on the basis of an original polishing method and added with a ceramic disc wax-removal cleaning method which can be used for better cleaning a ceramic disc in a wax-polishing process. The novel silicon wafer wax-polishing method employs a hairbrush and a wax-removal agent spraying device, wherein the hairbrush has higher elasticity and is not likely to deform. When brushing the surface of the ceramic disc, the hairbrush can cut residual wax print into countless fine wax strips, so that the novel silicon wafer wax-polishing method increases the contact area between residual wax and a chemical cleaning agent and enables the chemical reaction between the residual wax and the chemical cleaning agent to be more complete, and meanwhile the formed countless fine wax strip are more easily shaken off by ultrasonic waves of a follow-up cleaning machine. Meanwhile, the novel silicon wafer wax-polishing method employs a wax-removal agent recovery device, so that a wax-removal agent can be used repeatedly, and the cost is reduced. The novel silicon wafer wax-polishing method is simple in structure, convenient to operate and remarkable in cleaning effect.

Description

technical field [0001] The invention relates to the field of wax polishing of single crystal silicon wafers, in particular to a novel wax polishing method for silicon wafers. Background technique [0002] At present, VLSI manufacturing technology has developed to the era of 120mm and 300mm, and the technology with a characteristic line width of 100mm is also entering the market. With the further miniaturization of the feature line width, higher requirements are placed on the planarization degree of the silicon wafer surface. CMP (a method of polishing semiconductor materials using chemical reaction and mechanical grinding) is recognized as the best method for global planarization of materials in the ULSI (Ultra Large Scale Integration) stage. This method can not only obtain a more perfect surface, but also obtain a higher polishing rate. [0003] However, since the ceramic disks used for patching are recycled, the wax film on the ceramic disk cannot be completely removed b...

AI Technical Summary

Problems solved by technology

[0003] However, since the ceramic plate used for patching is recycled, the wax film of the ceramic plate cannot be completely removed by the wax removal machine. Long-term use will cause the wax film to accumulate seriously, resulting in wax residue on the polishing plate and even affecting the geometric parameters of the polishing plate.