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Method for improving copper precipitating and copper plating quality of PCB

A technology of PCB board and copper sinking, which is applied in the direction of liquid chemical plating, cleaning/polishing of conductive patterns, and formation of electrical connections of printed components, etc. It can solve problems such as excessive copper plating and blockage of through holes on PCB boards, and achieve Improve the uniformity of copper plating, avoid pollution, and improve the quality of the effect

Active Publication Date: 2015-04-15
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Therefore, the technical problem to be solved by the present invention is to overcome the problem that in the prior art, too little or no copper is deposited in the through hole of the PCB board after the copper sinking process is carried out on the PCB board, and there is too much copper plating in the through hole of the PCB board after the electroplating treatment. The technical problem of plugging through holes, thus providing a method to improve the quality of copper sinking and copper plating on PCB boards

Method used

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  • Method for improving copper precipitating and copper plating quality of PCB

Examples

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Embodiment 1

[0030] like figure 2 As shown, the present embodiment provides a method for improving the quality of copper sinking and copper plating of PCB boards. Clean, remove the loose copper layer left by the last copper sinking process attached to the sinking copper hanging basket, and then load the above PCB board to be sinking copper on the sinking copper hanging basket (upper board), and hang it with the sinking copper Basket together into the sinking copper potion for sinking copper, after sinking copper, remove the PCB board (lower board), clean the sinking copper hanging basket again, clean the copper particles and copper scraps on the sinking copper hanging basket, Then reload a new round of copper PCB boards to be sunk, and carry out the copper sinking work of the next round of PCB boards.

[0031]The method for improving the quality of copper sinking and copper plating on a PCB provided by this embodiment, by eliminating the main source of the above-mentioned copper particle...

Embodiment 2

[0036] This embodiment provides a method for improving the quality of copper sinking and copper plating on a PCB board, which is a further improvement to Example 1. In this embodiment, a water washing step is added after the micro-etching step, and water is used to remove the micro-etched sinker. The copper hanging basket should be washed with water to prevent the micro-etching liquid remaining on the copper sinking basket from contaminating the copper sinking potion in the copper sinking tank.

[0037] In the water washing step, first lift the copper sinking basket with the clean and crisp copper layer out of the cleaning tank, rinse it with tap water, and rinse it for 2 to 3 minutes at a flow rate of 10 to 20 lpm, then the remaining copper sinking basket can be removed. After the cleaning solution is rinsed clean, it can meet the requirement that the copper sinking PCB can be loaded without contaminating the copper sinking solution. The above tap water can also be replaced w...

Embodiment 3

[0039] Before the PCB board to be immersed copper enters the copper immersion process, it usually needs to be cleaned to remove impurities such as oil, dust, and debris attached to it. In factory automation and semi-automatic production, a program is usually set to control the immersion of the copper-immersed PCB into the micro-etching solution in the micro-etching tank. presented in the etched cylinder.

[0040] This embodiment is an improvement on the basis of Embodiment 1 or 2. The difference is that: this embodiment does not have a cleaning tank and cleaning solution specially used for cleaning the crispy copper layer, but uses the original cleaning solution for the PCB board to be immersed copper. Micro-etching cylinder and micro-etching liquid instead. This is because the above-mentioned micro-etching solution is prepared from sodium persulfate and sulfuric acid in a ratio of 1.5:1, wherein the concentration of the sodium persulfate is 50g / L, the concentration of the su...

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Abstract

The invention provides a method for improving the copper precipitating and copper plating quality of a PCB. The method comprises the steps of removing a loose copper layer deposited on a bearing part before a PCB to be copper-precipitated is loaded by use of the PCB bearing part for at least one time and removing the corrosion of the loose copper layer by use of a cleaning liquid. According to the method for improving the copper precipitating and copper plating quality of the PCB, the major source of shot copper or copper scraps causing the PCB to generate a copper precipitating quality problem is removed, the copper precipitating liquid medicine in a copper precipitating liquid medicine vat is maintained clean, when a copper precipitating process is carried out, the problem of too little precipitated copper or directly no copper in through holes, caused by affected normal flowing and exchange of the liquid medicine due to attachment of the shot copper or the copper scraps to the inner walls of the through holes is eliminated, the shot copper does not fall into the through holes of the PCB, the problem that the through holes are blocked by too much plated copper is prevented, and the product quality is improved.

Description

technical field [0001] The invention relates to a method for improving the quality of copper sinking and copper plating of PCB boards, and belongs to the field of copper sinking technology of PCB boards. Background technique [0002] Immersion copper is a common name for electroless copper plating. The purpose of sinking copper is to use the principle of chemical reaction to deposit a uniform conductive layer on the inner wall of the through hole of the PCB board, so that the originally insulated hole wall has conductivity, which facilitates the smooth progress of subsequent board surface plating, thereby realizing PCB board layer conduction between. [0003] The process of sinking copper process is as follows: first place multiple PCB boards in the sinking copper hanging basket as the carrier of the PCB board, then put the sinking copper hanging basket into the cylinder containing the sinking copper solution, and vibrate the sinking copper hanging basket Basket, so that t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42C23C18/18C23C18/38
CPCC23C18/18C23C18/38H05K3/26H05K3/42
Inventor 张傲
Owner NEW FOUNDER HLDG DEV LLC
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