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Long-life LED light-emitting module and processing method thereof

A light-emitting module, long-life technology, used in electrical components, circuits, semiconductor devices, etc., can solve problems such as disconnection and LED lamp failure, and achieve the effect of reducing uneven stress, reducing internal stress, and extending life.

Active Publication Date: 2015-04-15
徐州泰铭电气有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the gold wire of the LED light source module is disconnected under the impact of cyclic stress due to thermal expansion and contraction of the adhesive layer, which leads to the failure of the LED lamp

Method used

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  • Long-life LED light-emitting module and processing method thereof
  • Long-life LED light-emitting module and processing method thereof

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] Please check figure 1 , figure 1 A cross-sectional view of the LED lighting module is shown, including a transparent base 2, a plurality of LED bare crystals 4, a first phosphor adhesive layer 1 and a second phosphor adhesive layer.

[0028] The transparent base 2 is circular, and the material of the transparent substrate 2 is one of transparent ceramics, glass ceramics or single crystals with high thermal conductivity.

[0029] The multiple LED bare crystals 4 are bonded on the front of the transparent base 1 and bonded according to at least one annular ring arrangement. The center and t...

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Abstract

The invention provides a long-life LED light-emitting module and a processing method thereof. The LED light-emitting module comprises a transparent base, multiple LED dies and fluorescent powder rubber layers. The LED dies are bound on the front of the transparent base and arranged and bound according to at least one annular ring. The first fluorescent powder rubber layer covers the back of the transparent base. The second fluorescent powder rubber layer coats the front of the transparent base and is divided into at least one circular fluorescent powder rubber ring, the fluorescent powder rubber rings are in one-to-one correspondence to the annular rings, and each fluorescent powder rubber ring covers all the LED dies of the corresponding annular ring. The problem of LED lamp failure caused by the fact that gold wires of the LED light source module are disconnected under the impact of cyclic stress due to thermal expansion and contraction of the rubber layers is solved.

Description

technical field [0001] The invention relates to an LED light-emitting module and a processing method, in particular to a long-life LED light-emitting module and a processing method. Background technique [0002] The current mainstream packaging process for LED lamps is MCOB, which is formed by directly bonding the bare LED chip to the substrate with a die-bonding insulating adhesive, and then coating the bare LED chip with phosphor powder to convert the color of the light. In order to realize the 360-degree luminous effect of the LED light-emitting module, the substrate is usually a transparent substrate, and the side of the substrate that is not bonded to the bare LED crystal is also coated with phosphor glue for color conversion of the light. Such as the invention patent "201310244265.1", an LED bulb with omnidirectional light emission, the LED chip is fixed on the transparent substrate with crystal-bonding insulating glue, the surface of the LED chip and the back of the t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/00
CPCH01L33/005H01L33/48H01L33/505H01L2933/0033H01L2933/0041
Inventor 吴鼎鼎
Owner 徐州泰铭电气有限公司
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