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Packaging structure capable of achieving electricity property and heat dissipation through mechanical press mode and process method

A technology of mechanical lamination and packaging structure, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of easy failure, high cost, etc., and achieve the effects of good electrical performance, cost reduction, and good heat dissipation effect

Active Publication Date: 2015-03-25
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a packaging structure and process method for achieving electrical properties and heat dissipation by mechanical pressing, which can solve the problems of high cost and easy failure of traditional packaging with heat sinks

Method used

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  • Packaging structure capable of achieving electricity property and heat dissipation through mechanical press mode and process method
  • Packaging structure capable of achieving electricity property and heat dissipation through mechanical press mode and process method
  • Packaging structure capable of achieving electricity property and heat dissipation through mechanical press mode and process method

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Embodiment Construction

[0047] see figure 1 , figure 2 , the present invention is a packaging structure that realizes electrical properties and heat dissipation by means of mechanical pressing, which includes a pin 1, on which a chip 3 is flip-mounted through solder balls 2, and a heat dissipation frame 4 is arranged on the chip 3 , the four sides of the heat dissipation frame 4 are provided with claws 5 downward, and the spaces between the pins 1 , the chip 3 and the heat dissipation frame 4 and the periphery of the heat dissipation frame 4 are encapsulated with a plastic encapsulant 6 .

[0048] The bottom of the claw 5 is flush with the bottom of the pin 1 .

[0049] Its process method is as follows:

[0050] Step 1. Take the metal substrate

[0051] Step 2. Paste photoresist film

[0052] Paste a photoresist film that can be exposed and developed on the front and back of the metal substrate;

[0053] Step 3. Remove part of the photoresist film on the front and back of the metal substrate ...

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Abstract

The invention relates to a packaging structure capable of achieving electricity property and heat dissipation through a mechanical press fit mode and a process method. The structure comprises pins (1). A chip (3) is arranged on the pins (1) through solder balls (2) in an inverted mode and is provided with a heat dissipation frame (4). The four sides of the heat dissipation frame (4) are downwards provided with clamping claws (5). Molding compounds (6) are arranged among the pins (1), the chip (3) and the heat dissipation frame (4) and outside the heat dissipation frame (4) in a packaging mode. By means of the packaging structure capable of achieving the electricity property and heat dissipation through the mechanical press fit mode and the process method, the problems that traditional packaging with heat dissipation pieces is high in cost and prone to failure are solved.

Description

technical field [0001] The invention relates to a packaging structure and a process method for achieving electrical properties and heat dissipation in a mechanical pressing manner, and belongs to the technical field of semiconductor packaging. Background technique [0002] The traditional four-sided flat no-lead package with heat sink mainly has the following structure: [0003] A metal heat sink is pasted on the package, and the heat sink and the package are connected by an adhesive substance (such as image 3 shown). [0004] The above traditional packaging structure has the following disadvantages: [0005] In a traditional package with a heat sink, the package and the heat sink are connected by an adhesive material. The heat dissipation performance of the adhesive material affects the heat dissipation capability of the package. At the same time, if there is delamination between the adhesive material, the metal heat sink and the package, it will As a result, the heat ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/40H01L21/60
CPCH01L2224/16245H01L2224/73253
Inventor 郭小伟龚臻薛海冰
Owner JCET GROUP CO LTD
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